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Application of Data Mining for Improving Yield in Wafer Fabrication System

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Computational Science and Its Applications – ICCSA 2005 (ICCSA 2005)

Part of the book series: Lecture Notes in Computer Science ((LNTCS,volume 3483))

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Abstract

This paper presents a comprehensive and successful application of data mining methodologies to improve wafer yield in a semiconductor wafer fabrication system. To begin with, this paper applies a clustering method to automatically identify AUF (Area Uniform Failure) phenomenon from data instead of visual inspection that bad chips occurs in a specific area of wafer. Next, sequential pattern analysis and classification methods are applied to find out machines and parameters that are cause of low yield, respectively. Finally, this paper demonstrates an information system, Y2R-PLUS (Yield Rapid Ramp-up, Prediction, analysis & Up Support) that is developed in order to analyze wafer yield in a Korea semiconductor manufacturer.

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Author information

Authors and Affiliations

  1. Department of Business Administration, Hanyang University, 1271 Sa 1-dong, Sangrok-gu, Ansan-si, Gyeonggi-do, 426-791, Korea

    Dong-Hyun Baek & Chang Hee Han

  2. Department of Industrial Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-gu, Seoul, 133-391, Korea

    In-Jae Jeong

Authors
  1. Dong-Hyun Baek
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  2. In-Jae Jeong
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  3. Chang Hee Han
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Editor information

Editors and Affiliations

  1. Department of Mathematics and Computer Science, University of Perugia, via Vanvitelli, 1, I-06123, Perugia, Italy

    Osvaldo Gervasi

  2. Department of Computer Science, University of Calgary, 2500 University Drive N.W., T2N 1N4, Calgary, AB, Canada

    Marina L. Gavrilova

  3. William Norris Professor, Head of the Computer Science and Engineering Department, University of Minnesota, USA

    Vipin Kumar

  4. Department of Chemistry, University of Perugia, Via Elce di Sotto, 8, I-06123, Perugia, Italy

    Antonio Laganá

  5. Institute of High Performance Computing, IHCP, 1 Science Park Road, 01-01 The Capricorn, Singapore Science Park II, 117528, Singapore

    Heow Pueh Lee

  6. School of Computing, Soongsil University, Seoul, Korea

    Youngsong Mun

  7. Clayton School of IT, Monash University, 3800, Clayton, Australia

    David Taniar

  8. OptimaNumerics Ltd, Belfast, United Kingdom

    Chih Jeng Kenneth Tan

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© 2005 Springer-Verlag Berlin Heidelberg

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Baek, DH., Jeong, IJ., Han, C.H. (2005). Application of Data Mining for Improving Yield in Wafer Fabrication System. In: Gervasi, O., et al. Computational Science and Its Applications – ICCSA 2005. ICCSA 2005. Lecture Notes in Computer Science, vol 3483. Springer, Berlin, Heidelberg. https://doi.org/10.1007/11424925_25

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  • DOI: https://doi.org/10.1007/11424925_25

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-25863-6

  • Online ISBN: 978-3-540-32309-9

  • eBook Packages: Computer ScienceComputer Science (R0)

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