Abstract
In this paper, we present a smart machine vision (SMV) system for printed circuit board (PCB) inspection. It has advantages over the traditional manual inspection by its higher efficiency and accuracy. This SMV system consists of two modules, LIF (Learning Inspection Features) and OLI (On-Line Inspection). The LIF module automatically learns inspection features from the CAD files of a PCB board. The OLI module runs on-line to inspect PCB boards using a high-resolution 2-D sensor and the knowledge provided by the LIF components. Key algorithms developed for SMV are presented in the paper. The SMV system can be deployed on a manufacturing line with a much more affordable price comparing to other commercial inspection systems.
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References
Langley, F. J.: Imaging Systems for PCB inspection. Circuit Mauf. 25(1) (1985) 50–54
Beck, M., Clark, D.: SMT Inspection Strategies: Maximizing Cost Effectiveness. Proc. of Technical Program: NEPCON West’91 (1991) 1075–1081
Taylor, B. R.: Automatic Inspection in Electronics Manufacturing., SPIE Autom. Opt. Inspection 654l (1986) 157–159
Lu, Y.: Machine Vision Algorithms Using Interactive Learning for VFD Inspection. submitted to Journal of Applied Intelligence (2000)
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© 2001 Springer-Verlag Berlin Heidelberg
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Chen, T.Q., Zhang, J., Zhou, Y., Murphey, Y.L. (2001). A Smart Machine Vision System for PCB Inspection. In: Monostori, L., Váncza, J., Ali, M. (eds) Engineering of Intelligent Systems. IEA/AIE 2001. Lecture Notes in Computer Science(), vol 2070. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-45517-5_57
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DOI: https://doi.org/10.1007/3-540-45517-5_57
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Online ISBN: 978-3-540-45517-2
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