Abstract
This paper presents a new design of a system on a programmable chip (SOPC) for smart strain gage sensor. The system is designed to meet flexibility and complex computations required in compensation algorithm of strain gage thermal output. To satisfy the realtime processing constraints in one hand, and parameterization in another hand, parts of the algorithm are implemented in hardware and others are implemented in software. This new architecture, consisting of hardware and software functionalities, is implemented on an Altera APEX20K Field Programmable Gate Array (FPGA) including a NIOS core processor. A description of the methodology developed for the temperature compensation of the system is reported and the proposed system architecture is described.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Knapp, E. Altmann, J. Niemann, K.D. Werner: Measurement of shock events by means of strain gauges and accelerometers. Measurement, Elsevier (1998) 87–96
Somat product web site: http://www.somat.com/products/index.shtml
H. J. Howland, An integrated software/hardware approach to experimental stress analysis. Experimental stress analysis, Martinus Nijhoff publishers (1986) 263–270
Vishay web site: http://www.vishay.com.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2002 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Poussier, S., Rabah, H., Weber, S. (2002). SOPC-based Embedded Smart Strain Gage Sensor. In: Glesner, M., Zipf, P., Renovell, M. (eds) Field-Programmable Logic and Applications: Reconfigurable Computing Is Going Mainstream. FPL 2002. Lecture Notes in Computer Science, vol 2438. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-46117-5_124
Download citation
DOI: https://doi.org/10.1007/3-540-46117-5_124
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-44108-3
Online ISBN: 978-3-540-46117-3
eBook Packages: Springer Book Archive