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On the Technological Innovation Path of Artificial Intelligence in the Integration of Production and Education

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Book cover Cyber Security Intelligence and Analytics (CSIA 2021)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 1342))

Abstract

A new round of technological and industrial revolution is coming, and artificial intelligence with information technology as the core will become a hot spot in economic development. The industrial innovation and scientific progress triggered by artificial intelligence will surely lead the direction of scientific and technological innovation, and vocational education closely related to economy and society must respond to and lead this orientation. From the perspective of the integration of industry and education, this paper analyzes its characteristics, and explores how to exert the thrust of industrial revolution brought by artificial intelligence in the process of integration of industry and education to realize scientific and technological innovation.

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Acknowledgements

Topic 1: 2020 Guangdong science and technology plan project (Science and technology innovation popularization project) “offline curriculum development of university science popularization maker based on three-dimensional experience mode” (2020a1414050075).

Topic 2: key scientific research platform and scientific research projects of universities in Guangdong Province in 2018, research on the mode of production education integration based on the background of entrepreneurship and innovation education, (2018gwqncx022).

Topic 3: Research on the Visual Atlas of Traditional Handicraft Culture (2020WQNCX129), the 2020 Young Innovative Talents Project in Guangdong Colleges and Universities.

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Correspondence to Yadan Xu .

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Xu, Y., Li, Z. (2021). On the Technological Innovation Path of Artificial Intelligence in the Integration of Production and Education. In: Xu, Z., Parizi, R.M., Loyola-González, O., Zhang, X. (eds) Cyber Security Intelligence and Analytics. CSIA 2021. Advances in Intelligent Systems and Computing, vol 1342. Springer, Cham. https://doi.org/10.1007/978-3-030-70042-3_114

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