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Exploring Memory Hierarchy Design with Emerging Memory Technologies

Authors:

  • Provides a holistic study of using emerging memory technologies in different levels of the memory hierarchy
  • Equips readers with techniques for memory design with improved performance, energy consumption, and reliability
  • Includes coverage of all memory levels, ranging from cache to storage
  • Explains how to choose the proper memory technologies in different levels of the memory hierarchy

Part of the book series: Lecture Notes in Electrical Engineering (LNEE, volume 267)

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Table of contents (5 chapters)

  1. Front Matter

    Pages i-vii
  2. Introduction

    • Guangyu Sun
    Pages 1-11
  3. Conclusions

    • Guangyu Sun
    Pages 119-120
  4. Back Matter

    Pages 121-122

About this book

This book equips readers with tools for computer architecture of high performance, low power, and high reliability memory hierarchy in computer systems based on emerging memory technologies, such as STTRAM, PCM, FBDRAM, etc.  The techniques described offer advantages of high density, near-zero static power, and immunity to soft errors, which have the potential of overcoming the “memory wall.”  The authors discuss memory design from various perspectives: emerging memory technologies are employed in the memory hierarchy with novel architecture modification;  hybrid memory structure is introduced to leverage advantages from multiple memory technologies; an analytical model named “Moguls” is introduced to explore quantitatively the optimization design of a memory hierarchy; finally, the vulnerability of the CMPs to radiation-based soft errors is improved by replacing different levels of on-chip memory with STT-RAMs.

Authors and Affiliations

  • Peking University, Haidian District, Beijing, China, People's Republic

    Guangyu Sun

Bibliographic Information

  • Book Title: Exploring Memory Hierarchy Design with Emerging Memory Technologies

  • Authors: Guangyu Sun

  • Series Title: Lecture Notes in Electrical Engineering

  • DOI: https://doi.org/10.1007/978-3-319-00681-9

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2014

  • Hardcover ISBN: 978-3-319-00680-2Published: 02 October 2013

  • Softcover ISBN: 978-3-319-37595-3Published: 23 August 2016

  • eBook ISBN: 978-3-319-00681-9Published: 18 September 2013

  • Series ISSN: 1876-1100

  • Series E-ISSN: 1876-1119

  • Edition Number: 1

  • Number of Pages: VII, 122

  • Number of Illustrations: 14 b/w illustrations, 57 illustrations in colour

  • Topics: Circuits and Systems, Processor Architectures, Semiconductors

Buy it now

Buying options

eBook USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access