Skip to main content

Self-powered Active Cooling System for High Performance Processors

  • Chapter
  • First Online:

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 351))

Abstract

Thermal stability in datacenter’s computing units is fundamental to ensure reliability, and durability of the equipment, besides, environmental concern and new regulations require a reduction of the power used. For these reasons, a novel energy neutral hybrid cooling system is proposed. We describe the design, and the prototype’s performance evaluated both in passive and active cooling modes. During normal operating conditions, the thermo-electric energy harvesting system transforms wasted heat into electric energy, and stores it in super-capacitors while the system is providing passive cooling. Active cooling can be activated when a boost in performance requires CPU overclocking, using free energy from the passive step. After the choice of the most suitable harvesting system we designed and tested the prototype on an ARM based CPU, the future core of low-power server architectures. The proposed governor switches to active cooling mode based on customizable thermal management policies. Experimental results demonstrate good passive cooling performance, and several minutes active cooling exploiting the recovered heat.

This is a preview of subscription content, log in via an institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD   109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

References

  1. Choi, K., Soma, R., Pedram, M.: Dynamic voltage and frequency scaling based on workload decomposition. In: Proceedings of the 2004 International Symposium on Low Power Electronics and Design, 2004. ISLPED ’04, pp. 174–179 (2004)

    Google Scholar 

  2. Murali, S. et al.: Temperature control of high-performance multi-core platforms using convex optimization. In: Proceedings of the Conference on Design, Automation and Test in Europe, DATE ‘08, ACM, pp. 110–115 (2008)

    Google Scholar 

  3. Merritt, R.: Dell, IBM give thumbs up to ARM Servers. In: EE Times (2010)

    Google Scholar 

  4. Data Centre Specialist Group: Meeting the energy efficiency and financial challenges in it. Technical report, BCS (2007)

    Google Scholar 

  5. Suski, E.D.: Method and apparatus for recovering power from semiconductor circuit using thermoelectric device, 30 May 1995. US Patent 5,419,780

    Google Scholar 

  6. Solbrekken, G. et al.: Experimental demonstration of thermal management using thermoelectric generation. In: ITHERM ‘04. The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 284–290 (2004)

    Google Scholar 

  7. Wu, C.-J.: Architectural thermal energy harvesting opportunities for sustainable computing. Comput. Architect. Lett. (2013)

    Google Scholar 

  8. Rizzon, L., Rossi, M., Passerone, R., Brunelli, D.: Wireless sensor networks for environmental monitoring powered by microprocessors heat dissipation. In: Proceedings of the 1st International Workshop on Energy Neutral Sensing Systems, ENSSys ‘13. ACM (2013)

    Google Scholar 

  9. Rossi, M., Rizzon, L., Fait, M., Passerone, R., Brunelli, D.: Energy neutral wireless sensing for server farms monitoring. IEEE J. Emerg. Sel. Top. Circuits Syst. 4(3), 324–335 (2014)

    Article  Google Scholar 

  10. Prijic, A., Vracar, L., Vuckovic, D., Milic, D., Prijic, Z.: Thermal energy harvesting wireless sensor node in aluminum core PCB technology. IEEE Sens. J. 15(1), 337–345 (2015)

    Article  Google Scholar 

  11. Kiflemariam, R., Lin, C.-X.: Numerical simulation and parametric study of heat-driven self-cooling of electronic devices. J. Therm. Sci. Eng. Appl. ASME 7 (2015)

    Google Scholar 

  12. Rizzon, L., Rossi, M., Passerone, R., Brunelli, D.: Self-powered heat-sink SoC as temperature sensors with wireless interface: design and validation. In Proceedings of IEEE Sensors 2014, (2014)

    Google Scholar 

  13. Laird Technologies: Thermoelectric Handbook

    Google Scholar 

Download references

Acknowledgments

This work is supported by the European FP7 Project Green Data Net, grant n. 609000. http://www.greendatanet-project.eu/

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Maurizio Rossi .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2016 Springer International Publishing Switzerland

About this chapter

Cite this chapter

Rossi, M., Rizzon, L., Fait, M., Passerone, R., Brunelli, D. (2016). Self-powered Active Cooling System for High Performance Processors. In: De Gloria, A. (eds) Applications in Electronics Pervading Industry, Environment and Society. Lecture Notes in Electrical Engineering, vol 351. Springer, Cham. https://doi.org/10.1007/978-3-319-20227-3_4

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-20227-3_4

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-20226-6

  • Online ISBN: 978-3-319-20227-3

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics