Abstract
This paper uses an analytical approach to provide a performance analysis of a millimeter-wave short-range link for System in Package (SiP) applications. Thanks to an analytical modeling of the real Si-integrated antenna, an easy-to-use expression of the Intersymbol Interference (ISI) is derived and used to estimate the performance of the communication system. The performance of two different low-complexity binary constellations (bipolar and unipolar symbols) and four different pulse shapes, i.e., No-Return-to-Zero (NRZ), Return-to-Zero (RZ), Manchester (MAN) and Root-Raised-Cosine (RRC) are compared to highlight the different performance in relation to the tight area and power constraints.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsReferences
Dai, W.W.: Historical perspective of system in package (SiP). IEEE Circuit Syst. Mag. 16(2) (2016)
Zheng, X., Krishnamoorthy, A.V.: Si photonics technology for future optical interconnection. In: Communications and Photonics Conference and Exhibition (2011)
Gu, Q.J.: THz interconnect: the last centimeter communication. IEEE Commun. Mag. 53(4) (2015)
Saponara, S., Giannetti, F., Neri, B., Anastasi, G.: Exploiting mm-wave communications to boost the performance of industrial wireless networks. IEEE Trans. Industr. Inf. 13(3), 1460–1470 (2017)
Saponara, S., Giannetti, F., Neri, B.: Design exploration of mm-wave integrated transceivers for short-range mobile communications towards 5G. J. Circuits Syst. Comput. 26(4) (2017)
Saponara, S., Neri, B.: Radar sensor signal acquisition and multidimensional FFT processing for surveillance applications in transport systems. IEEE Trans. Instrum. Meas. 66(4), 604–615 (2017)
Saponara, S.: Wearable biometric performance measurement system for combat sports. IEEE Trans. Instrum. Meas. 66(10), 2545–2555 (2017)
Deb, S., Chang, K., et.al.: Design of an energy-efficient CMOS-Compatible NoC architecture with millimeter-wave wireless interconnects. IEEE Trans. Comput. 62(12) (2013)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer International Publishing AG, part of Springer Nature
About this paper
Cite this paper
Saponara, S., Ciarpi, G., Giannetti, F. (2019). Analysis and Simulations of mmW Transceiver for System-in-Package Communications. In: De Gloria, A. (eds) Applications in Electronics Pervading Industry, Environment and Society. ApplePies 2017. Lecture Notes in Electrical Engineering, vol 512. Springer, Cham. https://doi.org/10.1007/978-3-319-93082-4_13
Download citation
DOI: https://doi.org/10.1007/978-3-319-93082-4_13
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-93081-7
Online ISBN: 978-3-319-93082-4
eBook Packages: EngineeringEngineering (R0)