Abstract
Most of today’s wireless systems implement some sort of channel interleaving to minimize burst errors. The interleaver breaks the temporal correlation of successive samples by reshuffling them prior to transmission. In state-of-the-art solutions, this memory intensive operation is both power consuming due to frequent accesses to large memories and area inefficient due to poor memory-reuse. In this paper, we present a cluster-based deinterleaving method which makes a two-level custom memory hierarchy design possible. The access rate to large memories is reduced by performing sub-array deinterleaving inside much smaller memories thereby lowering the energy dissipation significantly. Moreover, this novel approach solves the memory-reuse bottleneck. Costly adaptation buffers become obsolete yielding a scalable, energy- and area-efficient architecture. The high-speed data packet access (HSDPA) defined in 3GPP serves as target application, where energy reductions of up to 60% with negligible logic overhead is observed for STMicroelectronics’ SRAM library in 0.13 μm CMOS technology.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
International Technology Roadmap for Semiconductors (ITRS), edition (2001), available from http://public.itrs.net
Catthoor, F., de Greef, E., Suytack, S.: Custom Memory Management Methodology: Exploration of Memory Organization for Embedded Multimedia System Design. Kluwer Academic Publishers, Norwell (1998)
Kim, N., et al.: Leakage Current – Moore’s Law Meets Static Power. IEEE Computer Society 36(12), 68–75 (2003)
Third Generation Partnership Project: TS 25.212 Release 5, available from http://www.3gpp.org
Yeo, E., Pakzad, P., Nikolic, B.: VLSI Architectures for Iterative Decoders in Magnetic Recording Channels. IEEE Transactions on Magnetics 37(2), 748–755 (2001)
Gilbert, F., When, N.: Architecture-Driven Voltage Scaling for High-Throughput Turbo- Decoders. In: Chico, J.J., Macii, E. (eds.) PATMOS 2003. LNCS, vol. 2799, pp. 379–388. Springer, Heidelberg (2003)
Heiskala, J., Terry, J.: OFDM Wireless LANs – A theoretical and Practical Guide, 1st edn. SAMS publisher (2001)
Ramsey, J.L.: Realization of optimum interleavers. IEEE Transactions on Information Theory IT-16, 338–345 (1970)
Uchida, Y., Ise, M., Onoye, T., Shirakawa, I., Arungsirsanchai, I.: VLSI Architecture of Digital Matched Filter and Prime Interleaver for W-CDMA. In: IEEE International Symposium on Circuits and Systems (ISCAS 2003), Arizona, USA, vol. 3, pp. 269–272 (2002)
Symbol Interleaver/Deinterleaver MegeCore Function User Guide, available from http://www.altera.com
Xilinx Interleaver/Deinterleaver Features & Data Sheets, available from http://www.xilinx.com
Richter, T., Fettweis, G.: Parallel Interleaving on parallel DSP architectures. In: IEEE Workshop on signal processing systems (SIPS 2002), San Diego, USA (2002)
Wuytack, S., Diguet, J.P., Cathhoor, F., De Man, H.: Formalized Methodology for Data Reuse Exploration for Low-Power Hierarchical Mappings. Special issue of IEEE Transactions on VLSI Systems on low power electronics and design 6(4), 529–537 (1998)
Benini, L., Macii, A., Macii, E., Poncino, M.: Synthesis of application-specific memories for power optimization in embedded systems. In: Design Automation Conference, pp. 300- 303 (2000)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2004 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Wellig, A., Zory, J., Wehn, N. (2004). Energy- and Area-Efficient Deinterleaving Architecture for High-Throughput Wireless Applications. In: Macii, E., Paliouras, V., Koufopavlou, O. (eds) Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation. PATMOS 2004. Lecture Notes in Computer Science, vol 3254. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-30205-6_24
Download citation
DOI: https://doi.org/10.1007/978-3-540-30205-6_24
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-23095-3
Online ISBN: 978-3-540-30205-6
eBook Packages: Springer Book Archive