Abstract
Wet etching is a popular process in the mass production for electronic devices, especially in the display and integrated circuit industry. The major techniques of wet etching are described in this chapter. It begins with a technical overview and discussion of the applications of wet etching in flat panel display fabrication. The chapter explains the principles of wet etching in terms of etching mechanisms, materials processing, and other critical factors. In the applications, some special requests are involved in the etching process. Moreover, the process requirements such as tools, etchants, special considerations, and control factors are also explained. The chapter concludes with a discussion on the future development of wet etching.
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Abbreviations
- BOE:
-
Buffered Oxide Etch
- CD:
-
Critical Dimension
- IGZO:
-
Indium Gallium Zinc Oxide
- ITO:
-
Indium Tin Oxide
- IZO:
-
Indium Zinc Oxide
- LCD:
-
Liquid Crystal Display
- MoW:
-
Molybdenum Tungsten
- TFT:
-
Thin-Film Transistor
References
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Further Reading
Rai-Choudhury P (1997) Handbook of microlithography, micromachining, and microfabrication, vol 1 and 2. SPIE Press and IEE Press, Bellingham, WA
Nguyen NT, Wereley S (2002) Fundamentals and applications of microfulidics. Artech House, Boston
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Jaeger RC (1993) Introduction to microelectronic fabrication. Addison-Wesley, Reading
Walker P, Tarn WH (1991) CRC handbook of metal etchants. CRC press, Boca Raton, pp 287–291
Kohler M (1999) Etching in Microsystem Technology. Wiley, New York, p 329
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© 2012 Springer-Verlag Berlin Heidelberg
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Cheng, HC. (2012). Wet Etching. In: Chen, J., Cranton, W., Fihn, M. (eds) Handbook of Visual Display Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-79567-4_59
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DOI: https://doi.org/10.1007/978-3-540-79567-4_59
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-79566-7
Online ISBN: 978-3-540-79567-4
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