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Handbook of Visual Display Technology pp 871–882Cite as

Dry Etching

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Abstract

Production of large area flat panel displays (FPDs) involves several pattern transfer and device fabrication steps that can be performed with dry etching technologies. Even though the dry etching using capacitively coupled plasma is generally used to maintain high etch uniformity, due to the need for the higher processing rates in FPDs, high density plasma processing tools that can handle larger area substrate uniformly are more intensively studied especially for the dry etching of polysilicon thin films. In the case of FPD processing, the current substrate size ranges from 730 mm × 920 mm (fourth generation) to 2,200 mm × 2,500 mm (eighth generation), and the substrate size is expected to increase further within a few years. This chapter aims to present relevant details on dry etching including the phenomenology, materials to be etched with the different recipes, plasma sources fulfilling the dry etching requirements, and advantages of dry etching over wet processing. Current status and future trends are also presented.

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Abbreviations

ARDE:

Aspect-Ratio Dependence-Etching

CCP:

Capacitively Coupled Plasmas

DBD:

Dielectric Barrier Discharge

ECR:

Electron Cyclotron Resonance

HWP:

Helicon Wave Plasmas

ICP:

Inductively Coupled Plasmas

PECVD:

Plasma Enhanced Chemical Vapor Deposition

RHP:

Right Hand Polarized

RIE:

Reactive Ion Etching

SWP:

Surface Wave Plasmas

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Further Reading

  • Kyung S-J, Park J-B, Lee Y-H, Lee J-H, Yeom GY (2007) High-speed etching of amorphous silicon using pin-to-plate dielectric barrier discharge. Surf Coat Technol 202:1204–1207

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Author information

Authors and Affiliations

  1. Risø DTU, Technical University of Denmark, Roskilde, 4000, Denmark

    Eugen Stamate

  2. Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, 440-746, South Korea

    Geun Young Yeom

Authors
  1. Eugen Stamate
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  2. Geun Young Yeom
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Corresponding author

Correspondence to Eugen Stamate .

Editor information

Editors and Affiliations

  1. Industrial Technology Research Institute, Hsinchu, Taiwan

    Janglin Chen

  2. Nottingham Trent University, Nottingham, UK

    Wayne Cranton

  3. Veritas et Visus, Texas, USA

    Mark Fihn

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© 2012 Springer-Verlag Berlin Heidelberg

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Stamate, E., Yeom, G.Y. (2012). Dry Etching. In: Chen, J., Cranton, W., Fihn, M. (eds) Handbook of Visual Display Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-79567-4_60

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