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New Field Emission Technologies

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Book cover Handbook of Visual Display Technology

Abstract

Field emission has had a long history of development, but has not emerged as an economic technology. The Spindt tip device has resolved many operational problems and much of our understanding of field emission process, but manufacturing difficulties have precluded mass market devices. Attention is turning to nanotechnology solutions. Nano-Spindt shows much promise and can potentially resolve the manufacture difficulty. The emergence of carbon electronics and especially carbon nanotubes has now provided a new momentum. Planar devices, no longer relying on geometric field enhancement, are an attractive technology with nanocomposites providing high internal electric fields, and simple printing and laser techniques offering a route to manufacturability. New theories for this are now emerging. The field emission display is still a great hope for an emissive, low-power, low-cost display that can challenge the dominance of LCD, and is tantalizingly close. However, at this point, there are no plans to manufacture these devices.

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Abbreviations

CNT:

Carbon Nanotube

FED:

Field Emission Display

MIM:

Metal–Insulator–Metal

PBS:

Porous Polycrystalline Silicon–Based Ballistic Electron Surface Display

SED:

Surface Conduction Electron-Emitter Display

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Author information

Authors and Affiliations

  1. Division of Electronic Engineering and Physics, University of Dundee, Nethergate, Dundee, DD1 4HN, UK

    Mervyn Rose & Yongchang Fan

Authors
  1. Mervyn Rose
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  2. Yongchang Fan
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Correspondence to Mervyn Rose .

Editor information

Editors and Affiliations

  1. Industrial Technology Research Institute, Hsinchu, Taiwan

    Janglin Chen

  2. Nottingham Trent University, Nottingham, UK

    Wayne Cranton

  3. Veritas et Visus, Texas, USA

    Mark Fihn

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© 2012 Springer-Verlag Berlin Heidelberg

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Rose, M., Fan, Y. (2012). New Field Emission Technologies. In: Chen, J., Cranton, W., Fihn, M. (eds) Handbook of Visual Display Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-79567-4_73

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