Skip to main content
SpringerLink
Log in

A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging

  • Conference paper
Intelligent Robotics and Applications (ICIRA 2008)

Part of the book series: Lecture Notes in Computer Science ((LNAI,volume 5315))

Included in the following conference series:

  • 2963 Accesses

Abstract

Flip-chip joining using anisotropic conductive adhesive (ACA) has many advantages. But the reliability of ACA interconnection is still a concern issue. There are many studies about the reliability, but little work was done about the bonding process’s effect. It is a coupled field problem which needs multi-physics simulation. In order to improve the reliability of the packaging, a parameters optimization method based on multi-physics simulation was developed. A response surface method was used to reduce the computational cost. A generic model was built as an illustration.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 189.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Chen, X., Zhang, J., Jiao, C.L., Liu, Y.M.: Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. Microelectronics Reliability 446, 774–785 (2006)

    Article  Google Scholar 

  2. Chan, Y.C., Luk, D.Y.: Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly ii. different bonding pressure. Microelectronics Reliability 42, 1195–1204 (2002)

    Article  Google Scholar 

  3. Frisk, L., Seppala, A., Ristolanien, E.: Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. Microelectronics Reliability 44, 1305–1310 (2004)

    Article  Google Scholar 

  4. Wu, Y.P., Alam, M.O., Chan, Y.C., Wu, B.Y.: Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. Microelectronics Reliability 44, 295–302 (2004)

    Article  Google Scholar 

  5. Pinardi, K., et.,, al.,: Effect of Bump Height on the Strain Variation During the Thermal Cycling Test of ACA Flip-Chip Joints. IEEE Transactions on Components and Packaging Technologies 23, 447–451 (2000)

    Article  Google Scholar 

  6. Wu, C.M.L., Liu, J., Yeung, N.H.: The effects of bump height on the reliability of ACF in flip-chip. Soldering & Surface Mount Technology 13(1), 25–30 (2001)

    Article  Google Scholar 

  7. Chiang, W.K., Chan, Y.C.: Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing. Journal of Electronic Packaging 127, 113–119 (2005)

    Article  Google Scholar 

  8. Teo, M., et al.: Effects of Anisotropic Conductive Adhesive (ACA) Material Properties on Package Reliability Performance. In: Electronics Packaging Technology Conference, 2003, pp. 718–725 (2003)

    Google Scholar 

  9. Yin, C.Y., et al.: Experimental and Modeling Analysis of the Reliability of the Anisotropic Conductive Films. In: 2003 Electronic Components and Technology Conference, pp. 698–702 (2003)

    Google Scholar 

  10. Yin, C.Y., et al.: Experimental and Modeling Analysis on Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film. In: 2005 International Conference on Asian Green Electronics, pp. 172–177 (2005)

    Google Scholar 

  11. Mercado, L.L., et al.: Failure Mechanism Study of Anisotropic Conductive Film (ACF) Packages. IEEE Transactions on Components and Packaging Technologies 26, 509–516 (2003)

    Article  Google Scholar 

  12. Storn, R., Price, K.: Differential evolution – A Simple and Efficient Heuristic for Global Optimization over Continuous Spaces. Journal of Global Optimization 11(4), 341–359 (1997)

    Article  MATH  MathSciNet  Google Scholar 

  13. Box, G.E.P., Wilson, K.B.: On the experimental attainment of optimum conditions. Journal of the Royal Statistical Society, Series B 13, 1–45 (1951)

    MathSciNet  Google Scholar 

  14. Teo, M., Subodh, G.M., et al.: Correlation of Material Properties to Reliability Performance of Anisotropic Conductive Adhesive Flip Chip Packages. IEEE Transactions on Components and Packaging Technologies 28(1), 157–164 (2005)

    Article  Google Scholar 

  15. Yeung, N.H., Chan, Y.C., Tan, C.W.: Effect of Bonding Force on the Conducting Particle With Different Sizes. Journal of Electronic Packaging, Transactions of the ASME 125, 624–629 (2003)

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China

    ZhengJia Wang, Yuhui Wang & Zhouping Yin

Authors
  1. ZhengJia Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yuhui Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Zhouping Yin
    View author publications

    You can also search for this author in PubMed Google Scholar

Editor information

Editors and Affiliations

  1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China

    Caihua Xiong

  2. The Institute of Industrial Research, University of Portsmouth, UK

    Honghai Liu

  3. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, 430074, Wuhan, P. R. China

    Yongan Huang  & Youlun Xiong  & 

Rights and permissions

Reprints and permissions

Copyright information

© 2008 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Wang, Z., Wang, Y., Yin, Z. (2008). A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. In: Xiong, C., Liu, H., Huang, Y., Xiong, Y. (eds) Intelligent Robotics and Applications. ICIRA 2008. Lecture Notes in Computer Science(), vol 5315. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-88518-4_96

Download citation

  • DOI: https://doi.org/10.1007/978-3-540-88518-4_96

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-88516-0

  • Online ISBN: 978-3-540-88518-4

  • eBook Packages: Computer ScienceComputer Science (R0)

Publish with us

Policies and ethics

Search

Navigation