Abstract
The implementations of parallel algorithms in solving partial differential equations (PDEs) for heat transfer problems are based on the high performance computing using distributed memory architecture. In this paper, the parallel algorithms are exploited finite difference method in solving multidimensional heat transfer problem for semiconductor components and polymer composite materials. Parallel Virtual Machine (PVM) and C language based on Linux operating system are the platform to run the parallel algorithms. This research focused on Red-Black Gauss Seidel (RBGS) iterative method. Parallel performance evaluations in terms of speedup, efficiency, effectiveness, temporal performance and communication cost are analyzed.
This is a preview of subscription content, log in via an institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
Zhan, Y., Sapatnekar, S.S.: A High Efficiency Full-Chip Thermal Simulation Algorithm. In: Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design, pp. 635–638 (2005)
Juma, M., Bafrnec, M.: Experimental Determination of Rubber Curing Reaction Heat Using the Transient Heat Conduction Equation. Chemical Papers 58(1), 29–32 (2004)
Wilkinson, B., Allen, M.: Parallel Programming Techniques and Applications Using Networked Workstations and Parallel Computers. Prentice Hall, Upper Saddle River (1999)
Solomon, A., Alexiades, V., Wilson, D.G.: The initial velocity of the emerging free boundary in a two-phase Stefan Problem with imposed flux. Siam J. Math. Anal. 18(5) (September 1987)
Gourlay, R., Mcguire, G.R.: J. Inst. Math. Appl. 7, 216 (1971)
University of Cambridge: Lecture Notes (Partial Differential Equation), http://www.damtp.cam.ac.uk/lab/people/sd/lectures/nummeth98/pdes.htm
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2009 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Alias, N., Darwis, R., Satam, N., Othman, M. (2009). Parallelization of Temperature Distribution Simulations for Semiconductor and Polymer Composite Material on Distributed Memory Architecture. In: Malyshkin, V. (eds) Parallel Computing Technologies. PaCT 2009. Lecture Notes in Computer Science, vol 5698. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-03275-2_38
Download citation
DOI: https://doi.org/10.1007/978-3-642-03275-2_38
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-03274-5
Online ISBN: 978-3-642-03275-2
eBook Packages: Computer ScienceComputer Science (R0)