Abstract
In this work, an application to simulate electric and magnetic phenomena during design of printed circuit boards (PCB) is presented. The commercial schematic simulation software currently uses advanced models of components, but not of connections. However, with Simul-EMI II it is possible to get results very close to physical reality of the electronic circuits, in the same environment of schematic simulation. The parasitic effects considered are: connection resistance (traces, solder pads and vias), insulation resistance (prepreg, air, solder mask, etc.), self inductance and capacity (traces, solder pads and vias) and mutual inductances and capacities. For that, several applications of data mining, parametric model extraction and knowledge management have been developed in the MATLABTM environment. Finally, the results of a PCB simulation with PSPICETM before and after Simul-EMI II application, together with the electronics laboratory validation tests, are shown.
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References
Jonson, H., Graham, M.: High Speed Signal Propagation - Advanced Black Magic. Prentice Hall, Upper Saddle River (2003)
Abhari, R., Eleftheriades, G.V., Deventer-Perkins, E.: Physics-Based CAD Models for the Analysis of Vias in Parallel-Plate Environments. IEEE Transactions on Microwave Theory and Techniques 49(10), 1697–1707 (2001)
Thierauf, S.C.: High-Speed Circuit Board Signal Integrity. Artech House, Norwood (2004)
Luna-Rodríguez, J.J.: Diseño de Circuitos Impresos: un Manual Teórico-Práctico con CadStar. Universidad de Córdoba, Córdoba (2008)
Klee, H.: Simulation of Dynamic Systems with MATLAB and Simulink. CRC Press, Boca Raton (2007)
Braithwaite, N., Weaver, G.: Electronic Materials inside Electronic Devices. The Open University, London (1990)
Scarlatti, A., Holloway, C.L.: An equivalent transmission-line model containing dispersion for high-speed digital lines with an FDTD implementation. IEEE Transactions on Electromagnetic Compatibility 43(4), 504–514 (2001)
Kusiak, A., Kurasek, C.: Data Mining of Printed-Circuit Board Defects. IEEE Transactions on Robotics and Automation 17(2) (2001)
Choudhary, A.K., Harding, J.A., Tiwari, M.K.: Data mining in manufacturing: a review based on the kind of knowledge. J. Intell. Manuf. 20, 501–521 (2009)
Barco Graphis, N.V.: Gerber RS-274X Format. User’s Guide. Gent. (2001)
Artwork Conversion Software, Inc., http://www.artwork.com/gerber/274x/rs274x.htm
Downey, A.B.: Physical Modeling in MATLAB. Green Tea Press, Needham (2008)
Abhari, R., Eleftheriades, G.V., Deventer-Perkins, E.: Analysis of Differential Vias in a Multilayer Parallel Plate Environment Using a Physics-Based CAD Model. In: IEEE International Microwave Symposium, Phoenix, pp. THIF-09-4 (2001)
Chen, H., Li, Q., Tsang, L., Huang, C.C., Jandhyala, V.: Analysis of a Large Number of Vias and Differential Signaling in Multilayered Structures. IEEE Transactions on Microwave Theory and Techniques 51(3), 818–829 (2003)
Kouzaev, G.A., Nikolova, N.K., Deen, M.J.: Circular-Pad Via Model Based on Cavity Field Analysis. IEEE Microwave and Wireless Components Letters 13(11), 481–483 (2003)
Quintáns, C.: Simulación de Circuitos Electrónicos con OrCAD® 16 Demo. Marcombo, Barcelona (2008)
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Luna-Rodríguez, JJ. et al. (2010). Simul-EMI II: An Application to Simulate Electric and Magnetic Phenomena in PCB Designs. In: García-Pedrajas, N., Herrera, F., Fyfe, C., Benítez, J.M., Ali, M. (eds) Trends in Applied Intelligent Systems. IEA/AIE 2010. Lecture Notes in Computer Science(), vol 6096. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-13022-9_49
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DOI: https://doi.org/10.1007/978-3-642-13022-9_49
Publisher Name: Springer, Berlin, Heidelberg
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