Abstract
The infiltration research is very important in slope engineering. When surface soil is saturated under rainfall condition, the boundary condition on surface soil is usually to be considered as imposed head instead of flux, and the water depth is simplified as 0. However, how does it influence the infiltration if ignore the water depth? In this paper, based on Richards’ equation, the infiltration process of a homogeneous soil column under a fixed head boundary on the column top is simulated by FEM method. With five different water depths on the top, the infiltration rate and cumulative infiltration are calculated. The results show that the depth of water has great influence to infiltration rate and cumulative infiltration. The mistakes of the method simplifying the water depth as 0 can not be neglected.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Wang, X., Liu, G., Wang, T.: Numerical Simulation of overall Process of Rainfall Infiltration in Unsaturated soil. Journal of China hydrology 27(1), 30–32 (2007) (in Chinese)
Xu, H., Zhu, Y., Cai, Y.-Q., et al.: Stability analysis of unsaturated soil slopes under rainfall infiltration. Rock and Soil Mechanics 26(12), 1957–1962 (2005) (in Chinese)
Lou, Y.: Finite element analysis of slope seepage and stability due to rainfall infiltration. Shui Li Xue Bao (supp.), 346–351 (2007) (in Chinese)
Richards, L.A.: Capillary conduction of liquids through porous medium. Physics 1, 318–333 (1931)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2011 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Tian, D. (2011). The Influence Research of Surface Water Depth to Infiltration. In: Jin, D., Lin, S. (eds) Advances in Computer Science, Intelligent System and Environment. Advances in Intelligent and Soft Computing, vol 105. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-23756-0_51
Download citation
DOI: https://doi.org/10.1007/978-3-642-23756-0_51
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-23755-3
Online ISBN: 978-3-642-23756-0
eBook Packages: EngineeringEngineering (R0)