Abstract
A major concern of current and future on-chip systems is the thermal problem i.e. electrical energy is dissipated leading to high chip temperatures. Short term effects may include transient malfunctioning whereas long-term effects may lead to deteriorating functionality (e.g. increased signal travel times) or to irreversible damage due to, for example, electro-migration. The problem worsens with the inception of 3D architectures as the per-surface dissipated electrical energy is larger, e.g. our evaluation shows an increase of 37.5% in peak temperature in an architecture with 2 layers compared to a single layer architecture. Our proposed concept addresses thermal problems in 3D-stacked many-core architectures resulting from high power densities. A hierarchical agent-based thermal management system initiates a proactive task migration onto cooler processing resources while a communication virtualization layer dynamically adapts and protects connectivity between (migrated) tasks and external I/Os.
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Ebi, T., Rauchfuss, H., Herkersdorf, A., Henkel, J. (2011). Agent-Based Thermal Management Using Real-Time I/O Communication Relocation for 3D Many-Cores. In: Ayala, J.L., García-Cámara, B., Prieto, M., Ruggiero, M., Sicard, G. (eds) Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation. PATMOS 2011. Lecture Notes in Computer Science, vol 6951. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-24154-3_12
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DOI: https://doi.org/10.1007/978-3-642-24154-3_12
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