Abstract
Nowadays many different types of chips are used virtually everywhere in the real world. Sometimes, it is necessary to ensure that a certain chip meets specific requirements. For this reason, it is essential to examine various properties of chips; one of those can be, e.g., the chip security with respect to its physical structure. This paper provides description of a proven chip decapsulation process (the presented process can be used to obtain bare chips for further analysis) and some additional information concerning analysis of the chips. Finally, a prototype of our application designated for later semiautomatic analysis is also briefly presented.
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References
Malcik, D.: Microscopic analysis of chips security, Diploma thesis, Faculty of Information Technology, Brno University of Technology (2011)
Szendiuch, I.: Zaklady technologie mikroelektronickych obvodu a systemu. VUTIUM (2006) ISBN 80-214-3292-6
Chung, D.: Materials for electronic packaging. Butterworth-Heinemann (1995) ISBN 978-0750693141
Tummala, R.: Fundamentals of Microsystems Packaging. McGraw Hill Professional (2001) ISBN 978-0071371698
Blackwell, G.R.: The Electronic Packaging Handbook. CRC Press (1999) ISBN 978-0849385919
Schobert, M.: All Chips Reversed. Die Datenschleuder 94, 17–36 (2010) ISSN 0930-1054
Chernyy, N.: HOW TO: write an IC Friday post (2008), http://microblog.routed.net/2008/07/15/how-to-write-an-ic-friday-post/
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© 2011 Springer-Verlag Berlin Heidelberg
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Malcik, D., Drahansky, M. (2011). Microscopic Analysis of Chips. In: Kim, Th., Adeli, H., Fang, Wc., Villalba, J.G., Arnett, K.P., Khan, M.K. (eds) Security Technology. SecTech 2011. Communications in Computer and Information Science, vol 259. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-27189-2_12
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DOI: https://doi.org/10.1007/978-3-642-27189-2_12
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-27188-5
Online ISBN: 978-3-642-27189-2
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