Abstract
PRO3D tackles two important 3D technologies, that are Through Silicon Via (TSV) and liquid cooling, and investigates their consequences on stacked architectures and entire software development. In particular, memory hierarchies are being revisited and the thermal impact of software on the 3D stack is explored. As a key result, a software design flow based on the rigorous assembly of software components and monitoring of the thermal integrity of the 3D stack has been developed. After 30 months of research, PRO3D proposes a complete tool-chain for 3D manycore, that integrates state-of-the-art tools ranging from system-level formal specification and 3D exploration, to actual programming and runtime control on the 3D system. Current efforts are directed towards extensive experiments on an industrial embedded manycore platform.
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Fabre, C. et al. (2013). PRO3D, Programming for Future 3D Manycore Architectures: Project’s Interim Status. In: Beckert, B., Damiani, F., de Boer, F.S., Bonsangue, M.M. (eds) Formal Methods for Components and Objects. FMCO 2011. Lecture Notes in Computer Science, vol 7542. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35887-6_15
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