Abstract
This paper presents an architecture of a goal directed, adaptive computer vision system. Principally, the system will be used for automatically detecting faulty Integrated Circuits (ICs). We work on the inspection problem in its entirety of image segmentation, 2D structure identification and 3D object interpretation. At first, 3D model objects which represent IC components are geometrically projected into the 2D space to get a 2D model of the image structures. Afterwards, procedures for extracting regions and identifying complex image structures are adaptively executed by taking the 2D model into account. Finally, the 3D model objects are validated and modified according to the actual identifications. A CCD camera which is tied to a microscope is used for taking the images. The focus plane of the microscope can be steered horizontally and vertically to change focus and position on the top of the IC. Based on the modifications of the 3D model, the section of interest will be changed automatically.
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© 1990 Springer-Verlag Berlin Heidelberg
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Pauli, J. (1990). Goal Directed, Adaptive Computer Vision for IC Bond Inspection. In: Großkopf, R.E. (eds) Mustererkennung 1990. Informatik-Fachberichte, vol 254. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-84305-1_67
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DOI: https://doi.org/10.1007/978-3-642-84305-1_67
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-53172-2
Online ISBN: 978-3-642-84305-1
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