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A Performance Prediction Model of Parallel DCT on Mobile Embedded Systems

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Book cover IT Convergence and Security 2012

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 215))

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Abstract

The recent development on semiconductor process and design technologies enables multi-core processors to become a dominant market trend in mobile devices. The parallel programming enabled by multi-core CPU can provide a great opportunity to increase the processing performance. This paper explores a performance prediction model of parallel DCT on heterogeneous mobile systems by measuring power dissipation. For our simulation, we implemented the fast DCT algorithm on various computing environments and the simulation results show the feasibility of the proposed method to estimate the performance gain in terms of power consumption on heterogeneous embedded systems.

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References

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Acknowledgments

This research is supported by Ministry of Culture, Sports and Tourism (MCST) and Korea Creative Content Agency (KOCCA) in the Culture Technology (CT) Research and Development Program 2012.

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Authors and Affiliations

  1. MC Division, LG Electronics, Seoul, Korea

    Yeong-Kyu Lim

  2. Department of Computer Science, Namseoul University, Cheonan, Korea

    Cheong-Ghil Kim

Authors
  1. Yeong-Kyu Lim
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  2. Cheong-Ghil Kim
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Corresponding author

Correspondence to Cheong-Ghil Kim .

Editor information

Editors and Affiliations

  1. Convergence Security, Kyoung-gi University, Suwon, Gyeonggi-do, Korea, Republic of (South Korea)

    Kuinam J. Kim

  2. Dept. of Computer Information Engineerin, Sangji University, Wonju-si Gangwon-do, Korea, Republic of (South Korea)

    Kyung-Yong Chung

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© 2013 Springer Science+Business Media Dordrecht

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Lim, YK., Kim, CG. (2013). A Performance Prediction Model of Parallel DCT on Mobile Embedded Systems. In: Kim, K., Chung, KY. (eds) IT Convergence and Security 2012. Lecture Notes in Electrical Engineering, vol 215. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-5860-5_90

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  • DOI: https://doi.org/10.1007/978-94-007-5860-5_90

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  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-007-5859-9

  • Online ISBN: 978-94-007-5860-5

  • eBook Packages: EngineeringEngineering (R0)

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