Abstract
The temperature of thermal buckling of the PCB is very low. The dynamic response characteristics of the PCB are very different from pre-buckling and post-buckling. The snap-through motion between multiple post buckled equilibrium positions introduces high level of alternating stress which reduces the fatigue life of the structures. The vibration equation for the PCB under thermo-acoustic load is derived in this paper. Thermal post buckling equilibrium Path is solved using the finite element method. The affection of the thermo-acoustic load on the dynamic response is analyzed with the study of the difference of dynamic response characteristics of the PCB from pre-buckling and post-buckling. The conclusions provide a reference for the calculation of stochastic dynamics with the consideration of the thermal buckling and the prediction of the PCB fatigue life under thermo-acoustic load. Furthermore, it lays a foundation for the structural optimization, which aims to increase the fatigue life of the PCB.
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References
Martin, P.L.: Electronic failure analysis handbook. McGraw-Hill Press, New York (1999)
Salvatore, L., David, F.: Vibration fatigue of surface mount technology (SMT) solder joints. In: IEEE Proceedings Annual Reliability and Maintainability Symposium, America, pp. 18–26 (1995)
Luo, M.Z., Kang, R., Liu, F.W.: A review of reliability prediction methods for electronic products. J. Electron. Sci. Technol. 1(2), 246–256 (2014)
Li, R., Kang, R.: A review of reliability prediction modifying methods for electronic systems (2007)
Ding, Y., Tian, R., Wang, X., et al.: Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. Microelectron. Reliab. 4(11), 2396–2402 (2015)
Yong, Z., Ma, L., Liu, S., et al.: The coupling effects of thermal cycling and high current density on Sn58Bi solder joints. J. Mater. Sci. 48(6), 2318–2325 (2013)
Ghaffarian R.: Thermal cycle and vibration/drop reliability of area array package assemblies. In: Structural Dynamics of Electronic and Photonic Systems, pp. 519–574 (2011)
Barker, D., Vodzak, J., Dasgupta, A., et al.: combined vibrational and thermal solder joint fatigue—a generalized strain versus life approach. J. Electron. Packag. 112(2), 129–134 (1990)
Basaran, C., Chandaroy, R.: Thermo mechanical analysis of solder joints under thermal and vibrational load. J. Electron. Packag. 124(1), 279–284 (2002)
Fan, X.: The Analysis and Application of Thermal Structure of Hypersonic Vehicle. National Defense Industry Press, Beijing (2009)
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© 2016 Springer Nature Singapore Pte Ltd.
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Cao, C., Huang, J., Qu, D., Zhang, M. (2016). Dynamic Response Characteristics of the PCB Under Thermo-Acoustic Load. In: Xu, W., Xiao, L., Li, J., Zhang, C., Zhu, Z. (eds) Computer Engineering and Technology. NCCET 2016. Communications in Computer and Information Science, vol 666. Springer, Singapore. https://doi.org/10.1007/978-981-10-3159-5_21
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DOI: https://doi.org/10.1007/978-981-10-3159-5_21
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