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PhysVib: Physically Plausible Vibrotactile Feedback Library to Collisions on a Mobile Device

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Book cover Haptic Interaction (AsiaHaptics 2016)

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 432))

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Abstract

This demo presents a mobile application using PhysVib: a software solution on the mobile platform extending an open-source physics engine for automatic vibrotactile feedback upon collision events in a multi-rate rendering architecture. PhysVib runs concurrently with a physics engine at a low update rate and generates vibrotactile feedback commands at a high update rate based on the simulation results of the physics engine using an exponentially-decaying sinusoidal model. We demonstrate an application showing three wall-object pairs with different material properties, and a user interacts with internal objects to feel vibrotactile feedback from collision events.

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Author information

Authors and Affiliations

  1. Pohang University of Science and Technology (POSTECH), Pohang, Republic of Korea

    Gunhyuk Park & Seungmoon Choi

Authors
  1. Gunhyuk Park
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  2. Seungmoon Choi
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Corresponding author

Correspondence to Seungmoon Choi .

Editor information

Editors and Affiliations

  1. Tokyo Institute of Technology, Yokohama, Kanagawa, Japan

    Shoichi Hasegawa

  2. Tohoku University, Sendai, Miyagi, Japan

    Masashi Konyo

  3. Electronics and Telecommunications Research Institute, Daejeon, Korea (Republic of)

    Ki-Uk Kyung

  4. The University of Electro-Communications, Tokyo, Japan

    Takuya Nojima

  5. The University of Electro-Communications, Tokyo, Japan

    Hiroyuki Kajimoto

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© 2018 Springer Nature Singapore Pte Ltd.

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Park, G., Choi, S. (2018). PhysVib: Physically Plausible Vibrotactile Feedback Library to Collisions on a Mobile Device. In: Hasegawa, S., Konyo, M., Kyung, KU., Nojima, T., Kajimoto, H. (eds) Haptic Interaction. AsiaHaptics 2016. Lecture Notes in Electrical Engineering, vol 432. Springer, Singapore. https://doi.org/10.1007/978-981-10-4157-0_68

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  • DOI: https://doi.org/10.1007/978-981-10-4157-0_68

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-4156-3

  • Online ISBN: 978-981-10-4157-0

  • eBook Packages: EngineeringEngineering (R0)

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