Abstract
In this work, an attempt has been made to investigate the performance of a new device, Wavy Junctionless FinFET at 22 nm node using low to high permittivity spacer for underlap regions. An alternative V TH extraction method has been demonstrated, which signifies the importance of cannel length at the nanoscale regime. The device layer Silicon film possesses uniform doping profile, where the current is controlled by channel doping and the mobility of charge carriers which account the bulk conduction instead of surface conduction. Due to the scalability of device dimensions, underlap regions are preferred to differentiate the control and the location of dopant atoms along the conduction region and hence this enhances the device performances. The simulation results enlighten the effectiveness of high permittivity of spacer region through performance evaluation. The simulated results exhibit an SS of 64 mV/decade, DIBL of 26 mV/V and I ON/I OFF ratio of 107.
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Progress in digital integrated electronics. In: 1975 International Electron Devices Meeting, pp. 11–13 (1975)
Dennard, R.H., Gaensslen, F.H., Rideout, V.L., Bassous, E., LeBlanc, A.R.: Design of ion-implanted MOSFET’s with very small physical dimensions. IEEE J. Solid-State Circuits 9, 256–268 (1974)
Roy, K., Mukhopadhyay, S., Mahmoodi-Meimand, H.: Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits. Proc. IEEE 91, 305–327 (2003)
Roll, G.: Leakage Current and Defect Characterization of Short Channel MOSFETs. Logos Verlag Berlin GmbH (2012)
Taur, T., Ning, T.H.: Fundamentals of Modern VLSI Devices. Cambridge University Press, New York (1998)
The International Technology Roadmap for Semiconductors (2015)
Van Dal, M.J.H., Collaert, N., Doornbos, G., Vellianitis, G., Curatola, G., Pawlak, B.J., Duffy, R., Jonville, C., Degroote, B., Altamirano, E., et al.: Highly manufacturable FinFETs with sub-10 nm fin width and high aspect ratio fabricated with immersion lithography. In: 2007 IEEE Symposium on VLSI Technology, pp. 110–111 (2007)
Goel, E., Kumar, S., Singh, B., Singh, K., Jit, S.: Two-dimensional model for subthreshold current and subthreshold swing of graded-channel dual-material double-gate (GCDMDG) MOSFETs. Superlattices Microstruct. 106, 147–155 (2017)
Rawat, G., Kumar, S., Goel, E., Kumar, M., Dubey, S., Jit, S.: Analytical modeling of subthreshold current and subthreshold swing of Gaussian-doped strained-Si-on-insulator MOSFETs. J. Semicond. 35, 84001 (2014)
Subramanian, V., Parvais, B., Borremans, J., Mercha, A., Linten, D., Wambacq, P., Loo, J., Dehan, M., Gustin, C., Collaert, N., et al.: Planar bulk MOSFETs versus FinFETs: an analog/RF perspective. IEEE Trans. Electron Devices 53, 3071–3079 (2006)
Sun, X., Lu, Q., Moroz, V., Takeuchi, H., Gebara, G., Wetzel, J., Ikeda, S., Shin, C., Liu, T.-J.K.: Tri-gate bulk MOSFET design for CMOS scaling to the end of the roadmap. IEEE Electron Device Lett. 29, 491–493 (2008)
Skotnicki, T., Hutchby, J.A., King, T.-J., Wong, H.-S., Boeuf, F.: The end of CMOS scaling: toward the introduction of new materials and structural changes to improve MOSFET performance. IEEE Circuits Devices Mag. 21, 16–26 (2005)
Li, Y., Hwang, C.-H.: Effect of fin angle on electrical characteristics of nanoscale round-top-gate bulk FinFETs. IEEE Trans. Electron Devices 54, 3426–3429 (2007)
El-Mamouni, F., Zhang, E.X., Ball, D.R., Sierawski, B., King, M.P., Schrimpf, R.D., Reed, R.A., Alles, M.L., Fleetwood, D.M., Linten, D.: others: Heavy-ion-induced current transients in bulk and SOI FinFETs. IEEE Trans. Nucl. Sci. 59, 2674–2681 (2012)
Colinge, J.-P., Lee, C.-W., Afzalian, A., Akhavan, N.D., Yan, R., Ferain, I., Razavi, P., O’Neill, B., Blake, A., White, M., Kelleher, A.-M., McCarthy, B., Murphy, R.: Nanowire transistors without junctions. Nat. Nanotechnol. 5, 225–229 (2010)
Lee, C.-W., Afzalian, A., Akhavan, N.D., Yan, R., Ferain, I., Colinge, J.-P.: Junctionless multigate field-effect transistor. Appl. Phys. Lett. 94, 53511 (2009)
Colinge, J.-P., Lee, C.-W., Ferain, I., Akhavan, N.D., Yan, R., Razavi, P., Yu, R., Nazarov, A.N., Doria, R.T.: Reduced electric field in junctionless transistors. Appl. Phys. Lett. 96, 73510 (2010)
Colinge, J.-P., Ferain, I., Kranti, A., Lee, C.-W., Akhavan, N.D., Razavi, P., Yan, R., Yu, R.: Junctionless nanowire transistor: complementary metal-oxide-semiconductor without junctions. Sci. Adv. Mater. 3, 477–482 (2011)
Doria, R.T., Pavanello, M.A., Trevisoli, R.D., de Souza, M., Lee, C.-W., Ferain, I., Akhavan, N.D., Yan, R., Razavi, P., Yu, R., et al.: Junctionless multiple-gate transistors for analog applications. IEEE Trans. Electron Devices 58, 2511–2519 (2011)
Mathew, L., Sadd, M., Kalpat, S., Zavala, M., Stephens, T., Mora, R., Bagchi, S., Parker, C., Vasek, J., Sing, D.: Inverted T channel FET (ITFET)-Fabrication and characteristics of vertical-horizontal, thin body, multi-gate, multi-orientation devices, ITFET SRAM bit-cell operation. A novel technology for 45 nm and beyond CMOS. In: Technical Digest IEEE International Electron Devices Meeting, IEDM, pp. 713–716 (2005)
Zhang, W., Fossum, J.G., Mathew, L.: The ITFET: a novel FinFET-based hybrid device. IEEE Trans. Electron Devices 53, 2335–2343 (2006)
Fossum, J.G., Wang, L.-Q., Yang, J.-W., Kim, S.-H., Trivedi, V.P.: Pragmatic design of nanoscale multi-gate CMOS. In: International Electron Devices Meeting, pp. 613–616 (2004)
Wong, H.-S.: Beyond the conventional transistor. IBM J. Res. Dev. 46, 133–168 (2002)
Lo, S.-H., Buchanan, D.A., Taur, Y., Wang, W.: Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET’s. IEEE Electron Device Lett. 18, 209–211 (1997)
Frank, D.J., Dennard, R.H., Nowak, E., Solomon, P.M., Taur, Y., Wong, H.-S.P.: Device scaling limits of Si MOSFETs and their application dependencies. Proc. IEEE 89, 259–288 (2001)
Cheng, B., Cao, M., Rao, R., Inani, A., Voorde, P.V., Greene, W.M., Stork, J.M.C., Yu, Z., Zeitzoff, P.M., Woo, J.C.S.: The impact of high-K gate dielectrics and metal gate electrodes on sub-100 nm MOSFETs. IEEE Trans. Electron Devices. 46, 1537–1544 (1999)
Tomaszewski, D., Głuszko, G., Łukasiak, L., Kucharski, K., Malesińska, J.: Elimination of the channel current effect on the characterization of MOSFET threshold voltage using junction capacitance measurements. Solid State Electron. 128, 92–101 (2017)
Han, M.-H., Chang, C.-Y., Chen, H.-B., Wu, J.-J., Cheng, Y.-C., Wu, Y.-C.: Performance comparison between bulk and SOI junctionless transistors. IEEE Electron Device Lett. 34, 169–171 (2013)
Colinge, J.P.: The SOI MOSFET: From single gate to multigate. In: Colinge, J.P. (ed.) FinFETs and Other Multi-Gate Transistors, pp. 1–48. Springer, Boston (2008). https://doi.org/10.1007/978-0-387-71752-4_1
Ho, B., Sun, X., Shin, C., Liu, T.-J.K.: Design optimization of multigate bulk MOSFETs. IEEE Trans. Electron Devices 60, 28–33 (2013)
Sun, X., Moroz, V., Damrongplasit, N., Shin, C., Liu, T.-J.K.: Variation study of the planar ground-plane bulk MOSFET, SOI FinFET, and trigate bulk MOSFET designs. IEEE Trans. Electron Devices 58, 3294–3299 (2011)
Pradhan, K.P., Sahu, P.K., Rajput, P., Pallempati, M.: Exploration of symmetric high-k spacer (SHS) hybrid FinFET for high performance application. Superlattices Microstruct. 90, 191–197 (2016)
Paz, B.C., Pavanello, M.A., Cassé, M., Barraud, S., Reimbold, G., Faynot, O., Avila-Herrera, F., Cerdeira, A.: From double to triple gate: modeling junctionless nanowire transistors. In: 2015 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), pp. 5–8 (2015)
Kranti, A., Yan, R., Lee, C.W., Ferain, I., Yu, R., Akhavan, N.D., Razavi, P., Colinge, J.P.: Junctionless nanowire transistor (JNT): properties and design guidelines. In: Proceedings of ESSDERC, pp. 357–360 (2010)
Sentaurus TCAD User’s Manual. In: Synopsys Sentaurus Device. Synopsys (2012). http://www.synopsys.com/
Klaassen, D.B.M.: A unified mobility model for device simulation-I. Model equations and concentration dependence. Solid State Electron. 35, 953–959 (1992)
Del Alamo, J., Swirhun, S., Swanson, R.M.: Simultaneous measurement of hole lifetime, hole mobility and bandgap narrowing in heavily doped n-type silicon. In: 1985 International Electron Devices Meeting, pp. 290–293 (1985)
Shockley, W., Read Jr., W.T.: Statistics of the recombinations of holes and electrons. Phys. Rev. 87, 835 (1952)
Saha, S.: MOSFET test structures for two-dimensional device simulation. Solid State Electron. 38, 69–73 (1995)
Jeon, D.-Y., Park, S.J., Mouis, M., Berthomé, M., Barraud, S., Kim, G.-T., Ghibaudo, G.: Revisited parameter extraction methodology for electrical characterization of junctionless transistors. Solid State Electron. 90, 86–93 (2013)
Saini, G., Choudhary, S.: Improving the subthreshold performance of junctionless transistor using spacer engineering. Microelectronics J. 59, 55–58 (2017)
Sahu, P.K., Mohapatra, S.K., Pradhan, K.P.: Zero temperature-coefficient bias point over wide range of temperatures for single-and double-gate UTB-SOI n-MOSFETs with trapped charges. Mater. Sci. Semicond. Process. 31, 175–183 (2015)
Lee, C.-W., Nazarov, A.N., Ferain, I., Akhavan, N.D., Yan, R., Razavi, P., Yu, R., Doria, R.T., Colinge, J.-P.: Low subthreshold slope in junctionless multigate transistors. Appl. Phys. Lett. 96, 102106 (2010)
Trevisoli, R., Doria, R.T., de Souza, M., Pavanello, M.A.: Substrate bias influence on the operation of junctionless nanowire transistors. IEEE Trans. Electron Devices 61, 1575–1582 (2014)
Rios, R., Cappellani, A., Armstrong, M., Budrevich, A., Gomez, H., Pai, R., Rahhal-Orabi, N., Kuhn, K.: Comparison of junctionless and conventional trigate transistors with Lg down to 26 nm. IEEE Electron Device Lett. 32, 1170–1172 (2011)
Schroder, D.K.: Semiconductor Material and Device Characterization. Wiley, Hoboken (2006)
Ghibaudo, G.: New method for the extraction of MOSFET parameters. Electron. Lett. 24, 543–545 (1988)
Flandre, D., Kilchytska, V., Rudenko, T.: gm/Id Method for threshold voltage extraction applicable in advanced MOSFETs with nonlinear behavior above threshold. IEEE Electron Device Lett. 31, 930–932 (2010)
Rudenko, T., Barraud, S., Georgiev, Y.M., Lysenko, V., Nazarov, A.: Electrical characterization and parameter extraction of junctionless nanowire transistors. J. Nano Res. 39, 17–33 (2016)
Koley, K., Dutta, A., Syamal, B., Saha, S.K., Sarkar, C.K.: Subthreshold analog/RF performance enhancement of underlap DG FETs with high-k spacer for low power applications. IEEE Trans. Electron Devices 60, 63–69 (2013)
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Vandana, B., Das, J.K., Mohapatra, S.K., Kaushik, B.K. (2017). Effectiveness of High Permittivity Spacer for Underlap Regions of Wavy-Junctionless FinFET at 22 nm Node and Scaling Short Channel Effects. In: Kaushik, B., Dasgupta, S., Singh, V. (eds) VLSI Design and Test. VDAT 2017. Communications in Computer and Information Science, vol 711. Springer, Singapore. https://doi.org/10.1007/978-981-10-7470-7_53
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