Component-based workflows for parallel thermomechanical analysis of arrayed geometries
- Rensselaer Polytechnic Inst., Troy, NY (United States). Scientific Computation Research Center
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- IBM, Yorktown Heights, NY (United States). Thomas J. Watson Research Center
Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. Here, we present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array.
- Research Organization:
- Simmetrix Inc., Clifton Park, NY (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), Fusion Energy Sciences (FES); USDOE Office of Science (SC), Advanced Scientific Computing Research (ASCR)
- Grant/Contract Number:
- SC0013919; SC0006617
- OSTI ID:
- 1410228
- Journal Information:
- Engineering with Computers, Vol. 33, Issue 3; ISSN 0177-0667
- Publisher:
- SpringerCopyright Statement
- Country of Publication:
- United States
- Language:
- English
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