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Modeling of data center airflow and heat transfer: State of the art and future trends

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Abstract

An assessment of the current thermal modeling methodologies for data centers is presented, with focus on the use of computational fluid dynamics and heat transfer as analysis tools, and model validation. Future trends in reduced or compact modeling of data center airflow and heat transfer are presented to serve as an overview of integrating rack-level compact models into full-scale facility level numerical computations. Compact models can be used to efficiently model data centers through varying model fidelity across length scales. Dynamic effects can be included to develop next-generation control schemes to maximize data center energy efficiency.

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References

  1. C.D. Patel, C.E. Bash, C. Belady, L. Stahl, and D. Sullivan, “Computational fluid dynamics modeling of high compute density data centers to assure system inlet air specifications,” Presented at Proc. IPACK’01 – The Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition Kauai, HI, 2001.

  2. “Data Center Energy Benchmarking Case Study.” California: Lawrence Berkeley National Laboratory and Rumsey Engineers, Inc., 2003.

  3. J.F. Karlsson and B. Moshfegh, “Investigation of indoor climate and power usage in a data center,” Energy and Buildings, vol. 37, pp. 1075–1083, 2005.

    Article  Google Scholar 

  4. R.R. Schmidt, E.E. Cruz, and M. Iyengar, “Challenges of data center thermal management,” IBM Journal of Research and Development, vol. 49, pp. 709–723, 2005.

    Article  Google Scholar 

  5. R.F. Sullivan, “Alternating cold and hot aisles provides more reliable cooling for server farms,” The Uptime Institute, 2002.

  6. D.B. Baer, “Emerging cooling requirements and systems in telecommunications spaces,” Liebert Corporation 2001.

  7. S. Kang, R.R. Schmidt, K.M. Kelkar, A. Radmehr, and S.V. Patankar, “A methodology for the design of perforated tiles in a raised floor data center using computational flow analysis,” presented at ITHERM 2000 – Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2000.

  8. R.R. Schmidt and H. Shaukatullah, “Computer and telecommunications equipment room cooling: a review of the literature,” presented at ITHERM 2002 – Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.

  9. E.C. Koplin, “Data center cooling,” ASHRAE Journal, vol. 45, pp. 46–53, 2003.

    Google Scholar 

  10. C. Belady, K.M. Kelkar, and S.V. Patankar, “Improving productivity in electronic packaging with flow network modeling (FNM),” Electronics Cooling, vol. 5, pp. 36–40, 1995.

    Google Scholar 

  11. R.R. Schmidt, K.C. Karki, K.M. Kelkar, A. Radmehr, and S.V. Patankar, “Measurements and predictions of the flow distribution through perforated tiles in raised floor data centers,” Presented at IPACK’01 – The Pacific Rim / ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, HI, 2001.

  12. R.R. Schmidt, K.C. Karki, and S.V. Patankar, “Raised-floor data center: perforated tile flow rates for various tile layouts,” Presented at ITHERM 2004 – Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, USA, 2004.

  13. J. Rambo and Y. Joshi, “Supply air distribution from a single air handling unit in a raised floor plenum data center,” Presented at ISHMT/ASME’04 –Joint Indian Society of Heat and Mass Transfer – American Society of Mechanical Engineers Heat and Mass Transfer Conference, Kalpakkam, India, 2004.

  14. A. Radmehr, R.R. Schmidt, K.C. Karki, and S.V. Patankar, “Distributed leakage flow in raised-floor data centers,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Franciso, CA, 2005.

  15. J.W. Van Gilder and R.R. Schmidt, “Airflow uniformity through perforated tiles in a rasied-floor data center,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  16. K.C. Karki, A. Radmehr, and S.V. Patankar, “Use of computational fluid dynamics for calculating flow rates through perforated tiles in raised-floor data centers,” International Journal of Heating, Ventilation, Air-Conditioning and Refrigeration Research, vol. 9, pp. 153–166, 2003.

    Google Scholar 

  17. Innovative Research Inc., TileFlow v. 3.0: A Simulation Tool for Airflow and Temperature Distribution in Raised-Floor Data Centers. Plymouth, MN, 2006.

  18. K.C. Karki and S.V. Patankar, “Airflow distribution through perforated tiles in raised-floor data centers,” Building and Environment, vol. 41, pp. 734–744, 2006.

    Article  Google Scholar 

  19. C.D. Patel, R. Sharma, C.E. Bash, and A. Beitelmal, “Thermal considerations in cooling of large scale high compute density data centers,” Presented at ITHERM 2002 – Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.

  20. R.K. Sharma, C.E. Bash, and C.D. Patel, “Dimensionless parameters for the evaluation of thermal design and performance of large-scale data centers,” AIAA, vol. AIAA 2002–3091, 2002.

  21. R.R. Schmidt and E. Cruz, “Raised floor computer data center: effect on rack inlet temperatures of chilled air exiting form both the hot and cold aisles,” Presented at ITHERM 2002 – Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.

  22. J. Rambo and Y. Joshi, “Multi-scale modeling of high power density data centers,” Presented at IPACK’03 – The Pacific Rim / ASME International Electronics Packaging Technical Conference and Exhibition, Kauai, HI, 2003.

  23. J. Rambo and Y. Joshi, “Physical models in data center airflow simulations,” Presented at IMECE’03 – ASME International Mechanical Engineering Congress and R&D Exposition, Washington D.C., 2003.

  24. R.R. Schmidt and E. Cruz, “Cluster of high powered racks within a raised floor computer data center: Effects of perforated tiles flow distribution on rack inlet air temperature,” Presented at IMECE’03 – ASME International Mechanical Engineering Congress and R&D Exposition, Washington D.C, 2003.

  25. R.R. Schmidt and E.E. Cruz, “Cluster of high-powered racks within a raised-floor computer data center: Effect of perforated tile flow distribution on rack inlet air temperatures,” ASME Journal of Electronic Packaging, vol. 126, pp. 510–518, 2004.

    Article  Google Scholar 

  26. S. Bhopte, D. Agonafer, R.R. Schmidt, and B. Sammakia, “Optimization of data center room layout to minimize rack inlet air temperature,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  27. L. Stahl and C. Belady, “Designing an alternative to conventional room cooling,” Presented at INTELEC’01 – 24th Annual International Telecommunications Energy Conference, 2001.

  28. S. Shrivastava, B. Sammakia, R.R. Schmidt, and M. Iyengar, “Comparative analysis of different data center airflow management configurations,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  29. M. Iyengar, R.R. Schmidt, A. Sharma, G. McVicker, S. Shrivastava, S. Sri-Jayantha, Y. Amemiya, H. Dang, T. Chainer, and B. Sammakia, “Thermal characterization of non-raised floor air cooled data centers using numerical modeling,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  30. R.R. Schmidt and M. Iyengar, “Effect of data center layout on rack inlet air temperatures,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  31. J. Rambo and Y. Joshi, “Convective transport processes in data centers,” Numerical Heat Transfer A – Applications, accepted for publication 2006.

  32. J. Rambo and Y. Joshi, “Thermal modeling of technology infrastructure facilities: A Case Study of Data Centers,” in The Handbook of Numerical Heat Transfer: Vol II, W.J. Minkowycz, E.M. Sparrow, and J.Y. Murthy, Eds. New York: Taylor and Francis, 2006, pp. 821–849.

    Google Scholar 

  33. R. Sharma, C.E. Bash, C.D. Patel, and M. Beitelmal, “Experimental investigation of design and performance of data centers,” Presented at ITHERM 2004 – Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.

  34. M. Norota, H. Hayama, M. Enai, T. Mori, and M. Kishita, “Research on efficiency of air conditioning system for data center,” Presented at INTELEC’03 – 25th International Telecommunications Energy Conference, Yokohama, Japan, 2003.

  35. A. Shah, V.P. Carey, C.E. Bash, and C.D. Patel, “Exergy analysis of data center thermal management systems,” Presented at IMECE’03 – ASME International Mechanical Engineering Congress and R&D Exposition, Washington, D.C, 2003.

  36. A.J. Shah, V.P. Carey, C.E. Bash, and C.D. Patel, “Exergy-based optimization strategies for multi-component data center thermal management: Part I: Analysis,” presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  37. A.J. Shah, V.P. Carey, C.E. Bash, and C.D. Patel, “Exergy-based optimization strategies for multi-component data center thermal management: Part II: Application and validation,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  38. J. Rambo and Y. Joshi, “Thermal performance metrics for arranging forced air cooled servers in a data processing cabinet,” ASME Journal of Electronic Packaging, vol. 127, pp. 452–459, 2005.

    Article  Google Scholar 

  39. M.K. Herrlin, “Rack cooling effectiveness in data centers and telecom central offices: The rack cooling index (RCI),” ASHRAE Transactions, vol. 111, pp. 725–731, 2005.

    Google Scholar 

  40. A. Heydari and P. Sabounchi, “Refrigeration assisted spot cooling of a high heat desnity data center,” Presented at ITHERM 2004 – Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.

  41. N. Rolander, J. Rambo, Y. Joshi, and F. Mistree, “Towards sustainable design of data centers: Addressing the lifecycle mismatch problem,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Franciso, CA, 2005.

  42. N. Rolander, J. Rambo, Y. Joshi, F. Mistree, and J.K. Allen, “Robust design of turbulent convective systems using the proper orthogonal decomposition,” ASME Journal of Mechanical Design: Special Issue Robust and Risk Based Design, accepted for publication 2006.

  43. J. Rambo, “Reduced-order modeling of multiscale turbulent convection: Application to data center thermal management,” Ph.D. Thesis, Department of Mechanical Engineering, Georgia Institute of Technology, 2006.

  44. J. Rambo and Y. Joshi, “Reduced order modeling of steady turbulent flows using the POD,” Presented at ASME Summer Heat Transfer Conference, San Francisco, CA, 2005.

  45. R.K. Sharma, C.E. Bash, C.D. Patel, R.J. Friedrich, and J.S. Chase, “Balance of power: Dynamic thermal management for internet data centers,” IEEE Internet Computing, vol. 9, pp. 42–49, 2005.

    Article  Google Scholar 

  46. C.D. Patel, C.E. Bash, R. Sharma, A. Beitelmal, and C.G. Malone, “Smart chip, system and data center enabled by advanced flexible cooling resources,” Presented at Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2005.

  47. K.E. Herold and R. Radermacher, “Integrated power and cooling systems for data centers,” Presented at ITHERM 2002 – Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.

  48. A.J. Shah and N. Krishnan, “Life evaluation of combined heat and power alternatives in data centers,” Presented at IEEE Interantional Symposium on Electronics and the Environment 2005.

  49. E. Fried and I.E. Idelchik, Flow Resistance: A Design Guide for Engineers. New York: Hemisphere Publishing, 1989.

    Google Scholar 

  50. T.D. Boucher, D.M. Auslander, C.E. Bash, C.C. Federspiel, and C.D. Patel, “Viability of dynamic cooling control in a data center environment,” Presented at ITHERM 2004 – Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.

  51. S.B. Pope, Turbulent Flows. New York: Cambridge University Press, 2000.

    MATH  Google Scholar 

  52. J.W. VanGilder and R.R. Schmidt, “Airflow uniformity through perforated tiles in a rasied-floor data center,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition, San Francisco, CA, 2005.

  53. Q. Chen and V. Modi, “Mass transfer in turbulent impinging slot jets,” International Journal of Heat and Mass Transfer, vol. 42, pp. 873–887, 1999.

    Article  MATH  Google Scholar 

  54. S. Maurel and C. Solliec, “A turbulent plane jet impingment nearby and far from a flat plate,” Experiments in Fluids, vol. 31, pp. 687–696, 2001.

    Article  Google Scholar 

  55. B. Merci, J. Vierendeels, C. DeLanghe, and E. Dick, “Numerical simulation of heat transfer of turbulent impinging jets with two-equation turbulence models,” International Journal of Numerical Methods for Heat and Fluid Flow, vol. 13, pp. 110–132, 2002.

    Google Scholar 

  56. T.H. Park, H.G. Choi, J.Y. Yoo, and S.J. Kim, “Streamline upwind numerical simulation of two-dimensional confined impinging slot jets,” International Journal of Heat and Mass Transfer, vol. 46, pp. 251–262, 2003.

    Article  MATH  Google Scholar 

  57. S.H. Seyedein and A.S. Majumdar, “Modeling of a Single Confined Turbulent Slot Jet Impingment using Various k-ε Turbulence Models,” Applied Mathematical Modeling, vol. 18, pp. 526–537, 1994.

    Article  MATH  Google Scholar 

  58. J. Rambo, G. Nelson, and Y. Joshi, “Airflow distribution through perforated tiles in close proximity to computer room air conditioning units,” Presented at ASHRAE Symposia, 2006, submitted.

  59. A. Bar-Cohen and W. Krueger, “Thermal characterization of chip packages – evolutionary design of compact models,” IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part A, vol. 20, pp. 399–410, 1997.

    Article  Google Scholar 

  60. C.J.M. Lasance, “Highlights from the european thermal project PROFIT,” ASME Journal of Electronic Packaging, vol. 126, pp. 565–570, 2004.

    Article  Google Scholar 

  61. B. Shapiro, “Creating reduced-order models for electronic systems: An overview and suggested use of existing model reduction and experimental system identification tools,” in Thermal Challenges in Next Generation Electronics Systems, Y.K. Joshi and S.V. Garimella, Eds. Rotterdam, Netherlands: Millpress, 2002, pp. 299–306.

    Google Scholar 

  62. J. Rambo, “Reduced-order modeling of multiscale turbulent convection: Application to data center thermal management” Ph.D. Thesis, Department of Mechanical Engineering, Georgia Institute of Technology, 2006.

  63. J. Rambo and Y. Joshi, “POD analysis of steady flows with parametric boundary conditions,” SIAM Journal of Scientific Computing, under review.

  64. R.L. Webb and H. Nasir, “Advanced technology for server cooling,” Presented at IPACK’05 – International Electronic Packaging Technical Conference and Exhibition San Francisco, CA, 2005.

  65. M. Wilson, J. Wattelet, and K. Wert, “A thermal bus system for cooling electronic components in high-density cabinets,” ASHRAE Transactions, pp. 567–573, 2004.

  66. Y. Furihata, H. Hayama, M. Enai, and T. Mori, “Improving the efficiency of cooling systems in data center considering equipment characteristics,” Presented at INTELEC – 26th Annual International Telecommunications Energy Conference, 2004.

  67. D. Wang, “A Passive solution to a difficult data center environment problem,” Presented at ITHERM 2004 – Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.

  68. D.L. Beaty, “Liquid cooling: friend or foe?,” ASHRAE Transactions, pp. 643–652, 2004.

  69. Y. Hwang, R. Radermacher, S. Spinazzola, and Z. Menachery, “Performance measurements of a force-convection air-cooled rack,” Presented at THERM 2004 – Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, 2004.

  70. R. Anton, H. Jonsson, and B. Palm, “Modeling of air conditioning systems for cooling of data centers,” Presented at ITHERM 2002 – Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2002.

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Rambo, J., Joshi, Y. Modeling of data center airflow and heat transfer: State of the art and future trends. Distrib Parallel Databases 21, 193–225 (2007). https://doi.org/10.1007/s10619-006-7007-3

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