Abstract
In order to learn the interconnect reliability of the complicated integrated circuit, a power amplifier 3D model is constructed and analyzed. The modeling and computation are completely automatic using the APDL. In order to predict the interconnect reliability of the power amplifier for the given design index effectively, the artificial neural networks model is used, then the prediction can be done fast. Training the simulation data from ANSYS, the neural network is used to model the relationship between the input and output. Then, a reliability database can be obtained which can help the designer to get the reliability performance of any design solution and the tradeoff decisions on the transistor’s size and the operation condition.
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Acknowledgments
This work was supported in part by the 863 Program of China (Contract No. 2015AA01A703), the Tianjin University-Qinghai University for Nationalities independent innovation fund cooperation project (2015), the international science and technology cooperation projects of Qinghai under Grant No. 2014-HZ-821 and the Chun Hui Project of Education Ministry( Z2015033).
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Lin, Q., Fu, H., He, F. et al. Interconnect Reliability Analysis for Power Amplifier Based on Artificial Neural Networks. J Electron Test 32, 481–489 (2016). https://doi.org/10.1007/s10836-016-5606-0
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DOI: https://doi.org/10.1007/s10836-016-5606-0