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Improvement of thermal stability of nickel germanide using nitrogen plasma pretreatment for germanium-based technology

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Acknowledgements

This work was supported in part by National Natural Science Foundation of China (Grant Nos. 61421005, 60806033, 61534004, 61474004) and National Key Research and Development Plan (Grant No. 2016YFA0200504).

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Authors and Affiliations

  1. Key Laboratory of Microelectronic Devices and Circuits, Institute of Microelectronics, Peking University, Beijing, 100871, China

    Bingxin Zhang, Xia An, Pengqiang Liu, Xiangyang Hu, Ming Li, Xing Zhang & Ru Huang

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  1. Bingxin Zhang
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  2. Xia An
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  3. Pengqiang Liu
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  4. Xiangyang Hu
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  5. Ming Li
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  6. Xing Zhang
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  7. Ru Huang
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Corresponding authors

Correspondence to Xia An or Ru Huang.

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Zhang, B., An, X., Liu, P. et al. Improvement of thermal stability of nickel germanide using nitrogen plasma pretreatment for germanium-based technology. Sci. China Inf. Sci. 61, 109401 (2018). https://doi.org/10.1007/s11432-018-9398-6

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  • DOI: https://doi.org/10.1007/s11432-018-9398-6

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