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Acknowledgements
This work was supported by National Natural Science Foundation of China (Grant No. 61674008) and National Key Research and Development (Grant No. 2016YFA0202101).
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Cai, L., Chen, W., Kang, J. et al. A physics-based electromigration reliability model for interconnects lifetime prediction. Sci. China Inf. Sci. 64, 219404 (2021). https://doi.org/10.1007/s11432-020-3140-4
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DOI: https://doi.org/10.1007/s11432-020-3140-4