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Filling the gap: thermal properties and device applications of graphene

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Abstract

With the miniaturization and integration of electronic devices, the heat dissipation problems caused by higher power density are getting more serious, limiting the development of integrated circuits industry. Graphene, as a representative of two-dimensional materials, has attracted extensive attention for its excellent thermal properties. Ever since it has been discovered, researches have been carried out and achievements have been made both theoretically and practically. Here, we review the established theories and simulation system for 2D heat conduction, different measurement methods for thermal conductivity and graphene’s device applications. We propose two gaps between different scales and between theoretical prediction and practical effect. Owing to the higher heat dissipation requirements and the endless pursuit of better thermal performance, it is challenging but critical to continue studying and further understand the thermal properties of graphene. Challenges and opportunities are both emphasized. It is hoped that the diversification and progress in morphology and manufacturing technology can bring new development and that graphene can eventually be widely used and make huge changes to micoelectronic industry.

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Acknowledgements

This work was supported in part by China Electronics Technology Group Corporation, Institute of Information Science (Grant No. H1125), National Natural Science Foundation of China (Grant Nos. 62022047, 61874065, 51861145202), National Key R&D Program (Grant No. 2016YFA0200400), Research Fund from Beijing Innovation Center for Future Chip and the Independent Research Program of Tsinghua University (Grant No. 20193080047), Young Elite Scientists Sponsorship Program by CAST (Grant No. 2018QNRC001), and Fok Ying-Tong Education Foundation (Grant No. 171051).

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  1. Institute of Microelectronics and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, 100084, China

    Rui Wu, Rui-Zhi Zhu, Shi-Hui Zhao, He Tian & Tian-Ling Ren

  2. Institute of High Performance Computing, A*STAR, Singapore, 138632, Singapore

    Gang Zhang

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  1. Rui Wu
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Correspondence to Gang Zhang, He Tian or Tian-Ling Ren.

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Wu, R., Zhu, RZ., Zhao, SH. et al. Filling the gap: thermal properties and device applications of graphene. Sci. China Inf. Sci. 64, 140401 (2021). https://doi.org/10.1007/s11432-020-3151-5

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