Defocusing image to pattern contact holes using attenuated phase shift masks

https://doi.org/10.1016/S0026-2692(03)00005-3Get rights and content

Abstract

The patterning of contact holes by selecting out-of-focus image plane (defocus) using attenuated phase shift masks (APSM) has been studied. Defocus is found to enhance the image modulation at low partial coherence for contact holes with negative local average of mask function. Semi-dense holes up to 130 nm in 8% APSM have been printed by 0.5 μm defocus at a partial coherence of 0.31 using KrF scanner with highest numerical aperture of 0.68. However, these holes were closed with in-focus imaging. Defocus is also found to be beneficial for patterning the pitches that have extensive side lobes with in-focus imaging.

Introduction

The resolution, whether astronomic or lithographic, has been defined by Rayleigh's formula [1], [2]R=K1λ/NA,where λ is the wavelength of the exposing radiation; NA, the numerical aperture of the projection system; and K1 is a process dependent parameter known as Rayleigh's constant. In practical terms, the resolution in microlithography is equal to the half of the smallest pitch resolved with specified depth of focus (DOF). Theoretically, the isolated features do not have any resolution limit and can always be patterned by changing the exposure energy. However, the aerial image size, which equals to the convolution of object function (amplitude or intensity) with respective impulse response [3], is defined by the size of impulse response until it is wider than the feature. The impulse response of the optical imaging system for infinitesimally small hole (point source) and infinitesimally fine space (line source) are point spread function (PSF) and line spread function (LSF), respectively, and are governed by the equations [4], [5]PSF(ρ)=2J1(2πρ)2πρ,andLSF(x)=−∞PSF(x,y)dy.The symbol J1 is the Bessel function of first kind, order 1 and ρ is the radial distance from the center of the image. The aerial image size has been reduced below PSF or LSF by using the phase shifting principle [5]. The use of attenuated phase shift masks (APSM) has been a popular method for enhancing resolution in optical lithography. Moreover, the image size is wider than PSF or LSF if the image plane is out of focus (defocus). Hence it would be difficult to believe that the defocus could be helpful in patterning the sub resolution features. However, the phenomenon of optical image reversal that occurs with APSM leads towards the use of defocusing image to pattern sub resolution features. The increase of non-lithographic lateral resolution in microscope and telescope by selecting out-of-focus image planes (defocus) has already been recognized [6].

This paper discusses the defocus approach to pattern the sub-resolution holes down to 130 nm in 8% APSM using KrF (248 nm exposing wavelength) 0.68 NA lithography scanner. Scanning electron microscope (SEM) top view pictures and PROLITH (lithography simulation tool from KLA Tencor) simulation graphs have been used to evaluate the defocus effect.

Section snippets

Imaging overview and analysis for APSM

In the projection optical system the exposing radiation gets partially diffracted by the object (mask) at the object plane and then collected by the lens system. The diffraction orders lying inside the projection aperture reach the image plane (wafer surface) and interfere to form the image. The placement of the image depends upon the location of the interference minima and maxima. Hence the intensity and size of the image vary with the phase and amplitude of the interfering rays.

In APSM both

Simulation and experimental results

Unless otherwise stated, all the simulations are limited to an aerial image and have been done using PROLITH 3D simulation tool. The experiments are carried out on Nikon KrF 0.68 NA Scanner using BIM and 8% APSM reticles. Low partial coherency (0.31) conventional illumination at projection lens of NA 0.68 is used for exposing the wafers. TEL ACT-8 wafer track system in line with scanner is used for resist processing. Resist and bottom antireflection coating (BARC) thickness are 4100 and 600 Å,

Conclusions

Based on our studies it is found that the defocus has been useful for patterning sub resolution contact holes using APSM. Semi-dense holes up to 130 nm in 8% APSM were resolved at 0.5 mm defocus at partial coherency of 0.31 using KrF 0.68 NA lithography scanner. At the same time, these holes were closed with in-focus imaging as expected. The defocus approach for patterning sub resolution contact holes using APSM is limited for the holes with negative local average of mask function and low partial

Acknowledgements

The authors would like to thank Santhanesh s/o Sathappan, Seiw Wai and Sun Hai Qin for their help in collecting the experimental data.

Navab Singh is a senior research engineer in the pattern transfer group at the Institute of Microelectronics, Singapore. He has master's degrees in Physics and Solid State Materials from the Indian Institute of Technology, Delhi. He worked previously as a photolithography engineer, developing 0.15 μm DRAM and DDR technologies.

References (9)

  • B.J. Lin

    Where is the lost resolution

    Proc. SPIE

    (1986)
  • M. Born et al.

    Principals of Optics

    (1998)
  • C. Scott

    Introduction to Optics and Optical Imaging

    (1998)
  • J.W. Goodman

    Introduction to Fourier Optics

    (1996)
There are more references available in the full text version of this article.

Cited by (0)

Navab Singh is a senior research engineer in the pattern transfer group at the Institute of Microelectronics, Singapore. He has master's degrees in Physics and Solid State Materials from the Indian Institute of Technology, Delhi. He worked previously as a photolithography engineer, developing 0.15 μm DRAM and DDR technologies.

Moitreyee Mukherjee-Roy is a member of the technical staff at the Institute of Microelectronics, Singapore. She is leading pattern transfer and PECVD groups for dual-damascene copper processes. She has a master's degree in Materials Science and Engineering from the University of Kentucky. She worked previously at Texas Instruments, developing logic and DRAM products.

Sohan Singh Mehta is a research engineer in the pattern transfer group at the Institute of Microelectronics, Singapore. He has master's degrees in Physics and Applied Optics from the Indian Institute of Technology, Delhi. He worked previously at TECH semiconductors, Singapore as a photolithography engineer, developing 0.13 μm DRAM and DDR technologies.

View full text