New qualification approach for optoelectronic components

This paper demonstrates the complementary relation between functional parameters and electroluminescence spectroscopy for reliability investigations of 1550 nm Semiconductor Optical Amplifiers of 700 μm length active region. Ageing tests have been set to 270 mA-100 °C-1500 h and realized on two different wafers showing more impact on wafer 1 than on wafer 2. Our investigations are particularly focused on interpretation of electroluminescence spectra, from reference and aged SOAs of wafer 1, leading to an improvement of degradation mechanisms understanding. The shift rate to lower energies of the recombination energy peak at 1550 nm, as reported by electroluminescence spectra between reference and aged SOAs in relation with the decrease of optical power measured at 200 mA for the degraded SOA and completed by I(V) characterizations, suggest occurrence of non radiative deep centers near the buried ridge structure in relation with the cleaning process uniformity of interfaces before epitaxial overgrowth. These defects mainly trap majority injected carriers instead of minority carriers reducing the luminescence in the active zone. By monitoring the most sensitive failure indicator (pseudo-threshold current), lifetime distributions are also calculated to determine failure rate, between 150 and 200 FITs over 15 years for operating conditions (25 °C-200 mA) using experimental degradation laws and statistic computations, demonstrating the overall robustness of this technology.

The purpose of this study is to present three-dimensional simulations using finite element method (FEM) of thermomechanical stresses and strains in 1550 nm Laser modules induced by Nd:YAG crystal Laser welds and thermal cycles on two main sub-assemblies: Laser submount and pigtail. Non-linear FEM computations, taking into account of experimental σ(ε) measured curves, show that Laser welding process can induce high level of strains in columns of the Laser platform, bearing the Laser diode, responsible of an optical axis shift and a gradual drop of the optical power in relation with relaxation of accumulated stresses in the sub-assembly. In the case of thermal cycles, stresses can occur on elements sensitive to coefficient of thermal expansion mismatches such as solder joint between the Laser platform and thermoelectric cooler and as fiber glued into the pigtail leading to crack propagation with sudden drop of optical power. The main objective of the paper is to evaluate thermomechanical sensitivity and critical zones of the Laser module in order to improve mechanical stability after Laser weld and reach qualification standards requirements without failures. Experimental analyses were also conducted to correlate simulation results and monitor the output optical power of Laser modules after 500 thermal cycles (−40 °C/+85 °C VRT).