Scanning Thermal Microscopy in Microsystem Reliability Analysis
References (0)
Cited by (10)
A SThM probe optimization and its time-space multi-scale modeling
2016, MechatronicsCitation Excerpt :In order to enhance the spatial resolution, a new design of thermoresistive probes has been proposed by Gotszalk and his coworkers in [11–13] which include a piezoresistive sensor for the tip displacement control. Recently, Janus and his colleagues have proposed a novel design [14–16] expecting quantitative temperature measurement in the range of 1K with a resolution of few tenths of nanometers. A first contribution of this paper is the design optimization of thermoresistive probes which is one of the key factors for high measurement precision.
Characterization of fatigued Al lines by means of SThM and XRD: Analysis using fast Fourier transform
2012, Microelectronics ReliabilityCitation Excerpt :We believe that these techniques may be effective tool for detection of defects in the structure of the Al interconnect caused by degradation. Results of our previous experiments with application of the SThM technique for Al lines characterization may be found in [13]. That paper focused on the difference between results obtained for active and passive modes of SThM operation.
Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices
2010, Microelectronic EngineeringMicrosystem technology as a road from macro to nanoworld
2005, BioelectrochemistryModelling, simulation and optimization for a SThm nanoprobe
2014, 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014