Elsevier

Microelectronics Journal

Volume 40, Issue 2, February 2009, Pages 204-209
Microelectronics Journal

Cubic group-III nitride-based nanostructures—basics and applications in optoelectronics

https://doi.org/10.1016/j.mejo.2008.07.036Get rights and content

Abstract

Molecular beam epitaxy (MBE) of cubic group-III nitrides is a direct way to eliminate the polarization effects which inherently limits the performance of optoelectronic devices containing quantum well or quantum dot active regions. In this contribution the latest achievement in the MBE of phase-pure cubic GaN, AlN, InN and their alloys will be reviewed. A new reflected high-energy electron beam (RHEED) control technique enables to carefully adjust stoichiometry and to severely reduce the surface roughness, which is important for any hetero-interface. The structural, optical and electrical properties of cubic nitrides and AlGaN/GaN will be presented. We show that no polarization field exists in cubic nitrides and demonstrate 1.55 μm intersubband absorption in cubic AlN/GaN superlattices. Further the progress towards the development and fabrication of cubic hetero-junction field effect transistors (HFETs) is discussed.

Introduction

State-of-the-art group-III nitride-based electronic and optoelectronic devices based on nitride films are grown along the polar c-direction, which suffer from the existence of strong “built-in” piezoelectric and spontaneous polarization. This inherent polarization limits the performance of optoelectronic devices containing quantum well (QW) or quantum dot active regions. To get around this problem much attention has been focused on the growth of non- or semi-polar (Al, Ga, In)N in the last few years. However, the direct way to eliminate polarization effects will be to use non-polar (0 0 1)-oriented zinc-blend III nitride layers. With cubic epilayers, a direct transfer of the existing GaAs technology to cubic III nitrides will be possible and the fabrication of diverse electronics and optoelectronic devices will be facilitated. In this paper the latest achievement in the molecular beam epitaxy (MBE) of phase-pure cubic GaN, AlN, InN and their application in optoelectronic devices will be reviewed.

Section snippets

Experiment

Cubic group-III nitride samples were grown on 200 μm thick, free standing 3C-SiC (0 0 1) substrates by MBE [1], [2]. An Oxford Applied Research HD25 radio frequency plasma source was used to provide activated nitrogen atoms. Indium, aluminum and gallium were evaporated from Knudsen cells. Prior to growth, the 3C-SiC substrates were chemically etched by organic solvents and a buffered oxide etch (BOE) and annealed for 10 h at 500 °C. Cubic GaN layers were deposited at 720 °C directly on 3C-SiC

RHEED control

As an important step to improve the GaN surface morphology in a systematic way, it is essential to understand the surface structure and the underlying growth process on an atomic scale. In particular, the kinetic processes of adsorption and desorption on the surface are considered as key parameters that govern the surface morphology, incorporation kinetics and consecutively the overall material quality. In MBE of GaN, two dimensional surfaces are commonly achieved under Ga-rich conditions, with

Conclusion

Cubic group-III nitrides grown by MBE may form the basis for future non-polar optoelectronic and electronic devices, which are not restricted by the inherent polarization effects. A new RHEED control technique enables to carefully adjust stoichiometry and to severely reduce the surface roughness. The structural, optical and electrical properties of cubic nitrides and AlGaN/GaN are presented. We proved the absence of polarization field in cubic nitrides and demonstrated 1.55 μm intersubband

Acknowledgements

The author wants to thank K. Lischka, S. Potthast, J. Schörmann, E. Tschumak, T. Schupp at University of Paderborn, Prof. M.O. Manasreh and E. DeCuir, Jr. at Arkansas State University, J. Gerlach at IOM Leipzig. R. Goldhahn at University of Ilmenau and T. Veal at University of Warwick. My special regards are expressed to Dr. M. Abe and Dr. H. Nagasawa at HOYA Corporation, for the supply of excellent 3C-SiC substrates and the financial support by DFG.

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