Planar and three-dimensional thick-film thermoelectric microgenerators

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Abstract

This paper describes manufacturing process as well as thermoelectric properties and long-term stability of planar and three-dimensional (3-D) thermoelectric structures made in thick-film/LTCC technology. Screen-printed thick-film thermocouples based on PdAg, Ag and Ni inks were manufactured and investigated. Seebeck coefficient and electrical output power were measured with the help of custom built automatic measuring system. Achieved results were compared with literature data and earlier authors’ results. Seebeck coefficient greater than 20 μV/K and about 5–8 μW/junction output power were measured for temperature difference of about 100 K for Ag–Ni thick-film planar thermocouple made on both used substrates. This combination of materials was chosen to create three-dimensional thick-film thermocouples (reported in the literature for the first time). We received for them Seebeck coefficient greater than 15 μV/K and the output power on level of 1 μW/junction for temperature gradient of about 60 K.

Introduction

When the ends of two different materials, A and B, are connected together and the junctions are put into different temperatures the thermoelectric force ET, measured in Volts (or more often in mV), appears between connection points and the current flows in the circuit [1], [2]. Selection of materials with good thermoelectric parameters is important to obtain good efficiency of the thermocouple. Seebeck coefficient (α), electrical conductivity (σ = 1/ρ) and thermal conductivity (λ), measured, respectively, in V/K (usually μV/K), 1/Ω and W/K m, are combined in the so-called thermoelectric figure-of-merit, Z = α2σ/λ [K−1] (the quantity W = α2σ [W/K−1 m−1] is called thermoelectric power factor).

In the case of a small temperature difference (several Kelvins) or for temperature independent material parameters these quantities can be used for direct comparison of thermoelectric materials, where the main target is connected with improving the figure-of-merit, Z or increasing the thermoelectric power factor, W. However, the transport properties α, σ and λ usually are temperature dependent. This results in a temperature dependent function Z(T). Thus, in any temperature range, materials with different properties have to be used in order to achieve a high figure-of-merit. Moreover, since Z varies with temperature, a more useful dimensionless figure-of-merit can be defined as Z · T.

The thermoelectric figure-of-merit of a thermocouple (thermogenerator) ZAB is defined asZAB=αAB2/(ρAλA÷ρBλB)2where αAB = αA  αB denotes the relative Seebeck coefficient and αA, αB – Seebeck coefficients of materials used for thermocouple arms (Fig. 1b) [3].

The thermoelectric power factor of a thermocouple WAB can be calculated from the formulaWAB=αAB2·σAB=αAB2/ρABwhere ρAB = ρA + ρB (ρA, ρB – electrical resistivity of materials A and B).

In general, the application of thermocouples in sensor systems and thermoelectric microgenerators is described in the literature very often [4], [5]. Thermoelectric force, ET depends on Seebeck coefficient α, thermal conductivity λ and structure dimensions:ET=n·α·ΔT=n·(αA-αB)·(TH-TC)ΔTλ·lt·wwhere n – number of thermocouples in thermopile, ΔT = TH  TC – temperature difference between hot and cold junction (measured in Kelvins), l, t, w – dimensions (length, thickness and width of thermocouple arms). In order to achieve a higher thermoelectric force, ET can effectively be multiplied by connecting the thermojunctions electrically in series and thermally in parallel.

Internal resistance depends on electrical resistivity ρAB and structure dimensions (we assumed that both thermocouple arms have the same dimensions)Ri=ρAB·lt·w[Ω],Output electrical power, POUT generated by such a structure is described by equation:POUT=ET24Ri[W],where Ri is the internal electric resistance of thermopile, ET is the thermoelectric force. Output electrical power, POUT is proportional to thermoelectric power factor, WAB.

Section snippets

Literature overview

The first paper about thick-film thermocouples was published in 1976 [6]. Since that time many different thick-film materials have been investigated for fabrication of thick-film thermocouples. But only a few papers treat about thick-film thermoelectric microgenerators. Thermoelectrical properties of thick-film thermocouples based on conductive inks are better understood than based on resistive inks ones [7]. Seebeck coefficients for so far investigated resistive and conductive compositions are

Planar thick-film thermoelectric microgenerators

Based on earlier results we have chosen a few materials which seem to have good thermoelectric and electric parameters (high Seebeck coefficient, low electrical resistivity) [7], [16]. We compared them and then the most promising materials were used to construct planar and 3-D microgenerators. Ag- (ESL 9912A), PdAg- (DP 6146 from DuPont or ESL 963 from ESL) with different Pd to Ag ratio and, what follows, different sheet resistivity) inks were compared. Moreover a new Ni-based ink (ESL 2554-N1)

Design

In this section we present three-dimensional structures of thick-film thermoelectric microgenerator for the first time. Such solution should make possible to increase the number of thermocouples and to multiply the output electrical power. Three various possible designs of 3-D thick-film thermoelectric microgenerators were considered (Fig. 5).

First type is similar to fabrication of thermal vias in LTCC (Low Temperature Cofired Ceramic) structure. But the main difference is connected with

Conclusions

This paper describes manufacturing process as well as thermoelectric properties and long-term stability of planar and three-dimensional thermoelectric structures made in thick-film/LTCC technology. Screen-printed thick-film thermocouples based on PdAg, Ag and Ni inks were manufactured and investigated. Our results for planar structures are much better than majority of literature data presented so far – especially from the microgenerator point of view, where both Seebeck coefficient and

Acknowledgements

This work was supported by the Polish Ministry of Science and Higher Education, Grant No. N515 049 31/1664 and Wrocław University of Technology, Grant 343 479 W-12.

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