Elsevier

Microelectronics Reliability

Volume 50, Issues 9–11, September–November 2010, Pages 1615-1620
Microelectronics Reliability

Assessment of dielectric charging in electrostatically driven MEMS devices: A comparison of available characterization techniques

https://doi.org/10.1016/j.microrel.2010.07.027Get rights and content

Abstract

The present work investigates the results of different characterization methods for the dielectric charging phenomenon applicable to metal–insulator–metal (MIM) capacitors and electrostatically actuated micro-electro-mechanical-systems (MEMS). The discharge current transients (DCT), thermally stimulated depolarization current (TSDC) and Kelvin probe force microscopy (KPFM) assessment methods have been applied to either MIM capacitors or electrostatic capacitive MEMS switches or both. For the first time, the KPFM methodology has been used to create a link between the results obtained from the DCT and TSDC techniques applicable for MIM and the results from MEMS switches. The comparison shows that the application of KPFM method to MIM and MEMS leads to the same results on the electrical properties of the dielectric material. This provides a novel powerful tool for the assessment of dielectric charging for MEMS switches using MIM capacitors which have much simpler layer structure. On the other hand the TSDC method reveals a continuous distribution of relaxation time constants, which supports the dependence of relaxation time constant calculated for MEMS on the duration of the observation time window.

Introduction

The increasing demand for more functional and flexible, yet lightweight and low-power-consumption wireless systems, has generated the need for a technology that can dramatically reduce manufacturing cost, size, and weight, and improve performance. Since MEMS technology enables batch fabrication of miniature mechanical transducers integrated with complementary metal–oxide semiconductor (CMOS) circuits, MEMS for radio frequency applications (RF-MEMS) provides an opportunity to meet these requirements. The term “RF-MEMS” encompasses several distinct types of devices, including RF switches, resonators, varactors and tunable inductors. Compared to conventional RF components, RF-MEMS offer significant benefits, including lower power consumption, lower insertion loss, lower cost and smaller form factor. Due to ease of fabrication and integration issues, electrostatically actuated MEMS devices are of high interest. However, such devices suffer from reliability issues related to dielectric charging. This phenomenon is found to be more pronounced in the case of electrostatic capacitive MEMS switches and currently results in hindering the commercialization of these devices [1].

The charging/polarization of a dielectric material arises from dipolar and space charge polarizations that often coexist and the electric field and polarization must then be considered as averaged over the thickness of the sample [2], [3]. This implies that the resulting charge displacement and microscopic dipoles orientation will give rise to a macroscopic dipole moment, which after removing the stressing voltage will decay and lead to discharge current transients (DCT) [4], [5], [6] or thermally stimulated depolarization currents (TSDC) [7] measured in external circuit of metal–insulator–metal (MIM) capacitors. In capacitive MEMS switches although the charging process is similar to the one in MIM capacitors the relaxation differs significantly since the injected charges are collected only through the bottom electrode when the applied voltage is removed and the suspended electrode is in the pull-up state. In MEMS the dielectric charging has been monitored through the shift of pull-down and pull-up voltages [8], [9] as well as voltage at which the pull-up capacitance becomes minimum [1]. Recently, Kelvin probe force microscopy (KPFM) has proved to constitute an efficient method to simulate charging through asperities [10], [11], [12], [13], [14] and assess the discharge process in MEMS dielectric by monitoring the film surface potential [13], [15].

In spite of these efforts there has been no correlation between the abovementioned assessment methods. Thus, the methods associated to MIM capacitors have been considered as efficient tools to assess the bulk properties of the dielectric film, which provide limited information and therefore being not appropriate to simulate MEMS. The aim of the present work is to reveal the common features and main differences between these assessment methods. In order to succeed this, the decay of surface potential of both MEMS insulating film and MIM capacitor top electrode were monitored and compared. Moreover, KPFM surface potential evolution with time was compared with the decay of DCT and TSDC spectra of MIM capacitors. To our knowledge, this is the first time to introduce a characterization methodology for the dielectric charging phenomenon based on KPFM for MIM capacitors.

The paper is organized as follows. First the theoretical background for the abovementioned assessment methods is presented. This is followed by the experimental details for each applied method. Finally, the results for each method as well as the correlation between the results obtained from different techniques are presented and discussed.

Section snippets

MIM discharge current transients

The dielectric charging in MIM capacitors has been often investigated through two methods, DCT and TSDC. Both methods are based on the application of electric field for a long time so that to produce saturation of dipole orientation and trapping of injected charges. This is followed by measuring the transient discharging currents in the external circuit.

Experimental approach

The dielectric materials used in this work are PECVD SiNx films with 500 nm thickness and were deposited using the high frequency deposition mode as presented in [14]. The investigated test structures for our experiments include circular MIM capacitors of 500 μm diameter and electrostatic MEMS capacitive switches, both employing the same SiNx film.

Four different characterization methods have been investigated which are DCT, TSDC, KPFM–MEMS and KPFM–MIM. For the DCT method, an electric filed is

Results and discussion

The surface potential decay measured through both KPFM–MEMS and KPFM–MIM techniques are shown in Fig. 2, Fig. 3, respectively. As the charge injection in MEMS switches is not uniform due to roughness and topography of both the bridge and the dielectric film, the surface potential decay has been analyzed in two different positions over the SiNx surface within the scanned area (5 μm × 5 μm). The selected two positions are the ones with the minimum (position 1) and maximum (position 2) surface

Conclusion

The charging of dielectric films used in MEMS capacitive switches has been assessed with the aid of the DCT and TSDC methods in MIM capacitors and the KPFM technique in MEMS switches and for the first time in MIM. The theoretical background on each method has been presented and used to highlight the potential and limitations of each method on drawing conclusions on the charging relaxation. The application of KPFM method in MIM capacitors leads to decay time constants similar to the ones

Acknowledgements

This work has been partially supported by the following projects: the French ANR Project FAME (PNANO-059), POLYNOE Project funded by European Defense Agency (B-0035-IAP1-ERG), and the SYMIAE Project funded by the Foundation STAE.

References (29)

  • U. Zaghloul et al.

    J Microelectron Reliab

    (2009)
  • E. Papandreou et al.

    J Microelectron Reliab

    (2007)
  • H.O. Jacobs et al.

    Ultramicroscopy

    (1997)
  • H. Yokoyama et al.

    Thin Solid Films

    (1994)
  • R. Daigler et al.

    J Microelectron Eng

    (2009)
  • V.M. Gun’ko

    Adv Colloid Interf Sci

    (2007)
  • I. Wibbeler et al.

    Sensor Actuator A: Phys

    (1998)
  • Vandershueren J, Casiot J, Braunlich P, editors. Berlin, vol. 37. Germany: Springer-Verlag; 1979 [chapter...
  • van Turnhout J. In: Sessler GM, editor. Topics in applied physics: electrets, vol. 33. Springer-Verlag, Berlin; 1987,...
  • Yuan X, Hwang JCM, Forehand Da, Goldsmith CL. In: International microwave symposium; 2005. p....
  • M. Lamhamdi et al.

    J Microelectron Reliab

    (2008)
  • W.M. van Spengen et al.

    J Micromech Microeng

    (2004)
  • S. Melle et al.

    IEEE Trans Microwave Theory Tech

    (2005)
  • Lamhamdi M, Boudou L, Pons P, Guastavino J, Belarni A, Dilhan M, et al. In: The 14th international conference on...
  • Cited by (29)

    • Dielectric charging induced drift in micro device reliability-a review

      2016, Microelectronics Reliability
      Citation Excerpt :

      Under the alternating electrostatic forces generated by alternating voltage, the charges cannot be accumulated to a same direction to form a high enough built-in voltage to influence the equilibrium of switch [106]. The dielectric charging remains one of the biggest obstacle to prevent micro switches from commercialization even though so many methods have been proposed to model and control it [35,38,70,97,106–110], because the differences in structures, materials, fabrication and packaging all can result in diversity in reliability of micro capacitive switches. Every single test or model maybe only suits to explain to what abnormality appears in the studied device and might not be totally transformed to commentate the underlying failure mechanism of other devices.

    • Electrostatic pull-in instability in MEMS/NEMS: A review

      2014, Sensors and Actuators, A: Physical
    • Reliability of RF MEMS

      2013, Handbook of Mems for Wireless and Mobile Applications
    View all citing articles on Scopus
    View full text