Microelectronics ReliabilityVolume 53, Issue 1, January 2013, Page 1EditorialReliability of micro-interconnects in 3D IC packagesAuthor links open overlay panelC. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao LaiShow moreShareCitehttps://doi.org/10.1016/j.microrel.2012.11.005Get rights and contentRecommended articlesReferences (0)Cited by (0)View full textCopyright © 2012 Elsevier Ltd. All rights reserved.