Elsevier

Integration

Volume 38, Issue 3, January 2005, Pages 505-513
Integration

Optimization of the VT­control method for low-power ultra-thin double-gate SOI logic circuits

https://doi.org/10.1016/j.vlsi.2004.07.004Get rights and content

Abstract

Application of the VT-control method is studied in ultra-thin double-gate (DG) SOI inverter, as the simplest building block of SOI logic circuits. Two control voltages, VCN and VCP, are applied to the back-gates of the n- and p-type transistors, respectively, to reduce the leakage current when the inverter is in the idle mode. Simulations with DESSIS disclose that both control voltages may be set at an optimum value for a given circuit activity, leading to the lowest possible gate power-delay product. Simulations have been performed for 10 nm gate-length technology at the end of the ITRS roadmap. These results indicate that the optimized VT-control method is a promising way for realizing low-power SOI logic circuits. Furthermore, the scalability of this technique is verified by extending the simulations to other generations of the ITRS roadmap.

Introduction

Optimization of the standby power is becoming more critical as the transistor size is scaled down to nanometric dimensions. As a direct consequence of the scaling trend, the transistor off-current is being increased to accommodate for the performance scaling, as predicted by the ITRS roadmap [1]. Inherent demands of digital applications make it necessary that a digital block remains in an idle mode for a long period of time. This requirement puts forth the inquiry for more elaborate standby power optimization techniques, especially for scaled devices.

One of the well-known methods of reducing the standby power is to minimize the subthreshold leakage current when a transistor is in the idle mode [2]. This may be achieved by controlling the threshold voltage in the sense that increasing its level during the idle mode reduces the leakage current. Also, in some applications different blocks on the chip have different specifications for speed and power consumption. Dual threshold voltage scheme is usually employed to address this requirement, but it is more attractive to have a mechanism that enables the designers to optimize the threshold voltage of the transistors in different blocks.

Applying a proper voltage to the body contact has been proposed to dynamically adjust the threshold voltage of bulk MOS transistors [3]. Also, optimization of the threshold voltage adjusting technique has been studied for bulk MOSFET's [4]. However, this approach has to deal with the problem of charging and discharging the bulk capacitor, which aggravates the total delay of the circuit.

The bulk capacitor problem is eliminated in double-gate (DG) SOI structure and the back-gate may be successfully used to control the threshold voltage. Feasibility of this approach has been demonstrated by fabricating novel SOIAS structures, where the active substrate provides a potentially wide range of threshold voltage adjusting by means of proper back-gate biasing [5], [6]. The VT-control method has been further studied by simulating various DG SOI structures for a single NMOS device and the advantage of the VT-control method in comparison with the conventional DG operation of these devices has been addressed [7].

In this work, we are concerned with optimizing the VT-control method for an inverter gate, which is the simplest building block of a logic circuit. Fig. 1 shows a SOI inverter in both conventional double-gate and VT-control configurations. In the DG configuration, the front and back gates are connected to each other, whereas in VT-control method the back gate is connected to a different voltage rather than the gate voltage, in order to control the drain–source leakage current in the idle mode. Two independent control voltages, VCN and VCP, are applied to the back gates of the n- and p-type transistors, respectively. When the input is low, the standby power is dominated by the n-type transistor, so a negative control voltage may be applied as VCN to reduce the leakage current drastically. Similarly, control voltage values higher than VDD would be needed for VCP. This may increase the complexity of the control and pulse generation blocks. However, the n+–p+ gates presented in [7] or metal gates with different work-functions may be employed to reduce the complexity by providing further pre-adjustment capability of the threshold voltage. This optimization approach was recently introduced in [8]. In this paper, we present this method in more details. In addition, the scalability of this approach is examined and verified by extending the simulations to a group of technology generations according to the ITRS roadmap.

Section snippets

Simulation

The DESSIS simulator [9] is employed to study the power consumption issue in 10 nm gate-length devices. The device structure given in Fig. 2 is considered for simulations [7]. The silicon thickness is chosen to be 3 nm in order to ensure the electrostatic integrity and controlled short channel effects; the 2 nm-thick back-gate oxide is selected twice as thick as the front-gate oxide for more reliable manufacturing; and the back-gate length is twice as that of the front-gate to alleviate the

Results and discussion

The simulated leakage current in the VT-control method and DG configuration is compared in Fig. 3. As observed in the plots, the leakage current is considerably reduced both for NMOS and PMOS transistors in comparison with the DG configuration. A controlling range of about three orders of magnitude is achievable in the leakage current, indicating the potential capability of the VT-control method in minimizing the standby power.

The total dynamic power resulting from charge-transfer to the top

Summary and conclusions

The application of the VT-control method in ultra-thin double-gate (DG) SOI inverter, as the simplest building block of SOI logic circuits was presented. It was shown that for any given circuit activity, there are optimum values of control voltages in VT-control method aimed to reduce power-delay product in DG SOI logic circuits. At each stage, the power consumption components and the total gate delay have been compared to the DG configuration. Our results revealed that the VT-control method is

Acknowledgments

The authors would like to thank Prof. Dimitri A. Antoniadis, Dr. Ali Keshavarzi, and Dr. Siva G. Narendra for inspiration and helpful discussions.

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