Abstract
Products motivated by performance-driven and/or density-driven goals often use Multi-Chip Module (MCM) technology, even though it still faces several challenging problems that need to be resolvedbefore it becomes a widely adopted technology. Among its mostchallenging problems is achieving acceptable MCM assembly yieldswhile meeting quality requirements. This problem can be significantlyreduced by adopting adequate MCM test strategies: to guarantee thequality of incoming bare (unpackaged) dies prior to module assembly;to ensure the structural integrity and performance of assembled modules; and to help isolate the defective parts and apply the repair process.
This paper describes today‘s MCM test problems and presents thecorresponding test and design-for-testability (DFT) strategies usedfor bare dies, substrates, and assembled MCMs.
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Zorian, Y. Fundamentals of MCM Testing and Design-for-Testability. Journal of Electronic Testing 10, 7–14 (1997). https://doi.org/10.1023/A:1008204009421
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DOI: https://doi.org/10.1023/A:1008204009421