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Electron Beam Probing—A Solution for MCM Test and Failure Analysis

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Abstract

Electron beam probing is applied for test and analysis of miniaturisedMCM structures. Wiring structures are tested for shorts and opens while fullyassembled MCMs are analysed in order to identify process or design problems[1, 2]. An electron beam short/open tester for laminated substrates has beendeveloped and installed. It allows the test of substrates up to a size of300 × 300 mm2 with a spot size ofbelow 30 μm without mechanical movement. The system is automated for routineapplication in the fabrication line. Electron beam probe stations are common tools for design verification and debugging ofintegrated circuits. This type of system was adapted to MCMrequirements. The travel range was extended to 80 × 100 mm2 to allow for waveform measurements anddiagnostics.

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References

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Authors and Affiliations

  1. Ebetech Electron-Beam Technology GmbH, Klausnerring 1a, D-85551, Heimstetten, Germany

    R. Schmid, R. Schmitt, M. Brunner, O. Gessner & M. Sturm

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  1. R. Schmid
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  2. R. Schmitt
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  3. M. Brunner
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  4. O. Gessner
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  5. M. Sturm
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Schmid, R., Schmitt, R., Brunner, M. et al. Electron Beam Probing—A Solution for MCM Test and Failure Analysis. Journal of Electronic Testing 10, 55–63 (1997). https://doi.org/10.1023/A:1008270430950

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  • DOI: https://doi.org/10.1023/A:1008270430950

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