Abstract
This paper highlights the development and effectiveness of a multichip module (MCM) Design-For-Testability methodology for an application intended for use in a fully electronic active matrix LCD flight instrument. MCM test issues discussed include Design-For-Testability, substratetest, Known-Good Die (KGD) and module level test.
The design incorporates IEEE 1149.1 and Built-In-Self-Test features. Bare die pretest is accomplished with a Ball Grid Array (BGA) chip carrierapproach.
The hardware consists of a mature digital design comprised of application specific and industry standard integrated circuits.
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Jorgenson, J.A., Wagner, R.J. Design-For-Test in a Multiple Substrate Multichip Module. Journal of Electronic Testing 10, 97–107 (1997). https://doi.org/10.1023/A:1008278700000
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DOI: https://doi.org/10.1023/A:1008278700000