|
For Full-Text PDF, please login, if you are a member of IEICE,
or go to Pay Per View on menu list, if you are a nonmember of IEICE.
|
2-Dimensional OVSF Spread/Chip-Interleaved CDMA
Le LIU Fumiyuki ADACHI
Publication
IEICE TRANSACTIONS on Communications
Vol.E89-B
No.12
pp.3363-3375 Publication Date: 2006/12/01 Online ISSN: 1745-1345
DOI: 10.1093/ietcom/e89-b.12.3363 Print ISSN: 0916-8516 Type of Manuscript: PAPER Category: Wireless Communication Technologies Keyword: CDMA, multi-rate, uplink transmission, chip interleaving, 2-dimensional OVSF spreading,
Full Text: PDF(1.2MB)>>
Summary:
Multiple-access interference (MAI) limits the bit error rate (BER) performance of CDMA uplink transmission. In this paper, we propose a generalized chip-interleaved CDMA with 2-dimensional (2D) spreading using orthogonal variable spreading factor (OVSF) codes to minimize the MAI effects and achieve the maximum available time- and frequency-domain diversity gains. We present the code assignment for 2D spreading to provide users with flexible multi-rate data transmission. A computer simulation shows that by the joint use of 2D OVSF spreading and chip-interleaving, MAI-free transmission is possible for the quasi-synchronous DS- or MC-CDMA uplink, and hence the single-user frequency-domain equalization based on the MMSE criterion can be applied for signal detection. The BER performance in a time- and frequency-selective fading multiuser channel is theoretically analyzed and evaluated by both numerical computation and computer simulation.
|
|
|