77-GHz MMIC Module Design Techniques for Automotive Radar Applications

Yasushi ITOH
Kazuhiko HONJO

Publication
IEICE TRANSACTIONS on Electronics   Vol.E88-C    No.10    pp.1939-1946
Publication Date: 2005/10/01
Online ISSN: 
DOI: 10.1093/ietele/e88-c.10.1939
Print ISSN: 0916-8516
Type of Manuscript: REVIEW PAPER
Category: 
Keyword: 
millimeter-wave,  MMIC,  module,  automotive radar sensor,  MCM,  SiP,  SoC,  flip-chip,  

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Summary: 
Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving from high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.