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Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology Hiroyuki ITO Hideyuki SUGITA Kenichi OKADA Tatsuya ITO Kazuhisa ITOI Masakazu SATO Ryozo YAMAUCHI Kazuya MASU Publication IEICE TRANSACTIONS on Electronics Vol.E90-C No.3 pp.641-643 Publication Date: 2007/03/01 Online ISSN: 1745-1353 DOI: 10.1093/ietele/e90-c.3.641 Print ISSN: 0916-8516 Type of Manuscript: LETTER Category: Microwaves, Millimeter-Waves Keyword: wafer-level chip scale package, RF CMOS, passive device, Full Text: PDF(290KB)>>
Summary: This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90  directional coupler using the WL-CSP technology has center frequency of 25.6 GHz, insertion loss of -0.5 dB and isolation of -29.8 dB in the measurement result. The WL-CSP technology contributes to realize low-loss RF passive devices on Si CMOS chip, which is indispensable to achieve small-size, cost-effective and low-power monolithic wireless communication circuits (MWCCs). | |||||
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