3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing

Shu YUAN
Dongping TIAN
Yanxing ZENG

Publication
IEICE TRANSACTIONS on Electronics   Vol.E89-C    No.5    pp.602-607
Publication Date: 2006/05/01
Online ISSN: 1745-1353
DOI: 10.1093/ietele/e89-c.5.602
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Fundamental and Application of Advanced Semiconductor Devices)
Category: Si Devices and Processes
Keyword: 
machine vision,  structured light ranging,  wave-front aberration correction,  

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Summary: 
For the measurement of the 3D surface of micro-solderballs in IC (Integrated Circuit) manufacturing inspection, a binary grating project lenses of high MTF (Modulation Transfer Function) with tilted project plane is designed in this paper. Using a combination of lenses and a tilted optical layout both on object and image plane, the wave-front aberrations are reduced and the nonlinear image distortion is corrected with nonlinearity compensation, This optical lens allows us to project the structured light pattern to the inspected objects efficiently for clear deformed coded imaging, it could be used to online measure 3D shape of micro-solderballs with high precision and accuracy.