LSI On-Chip Optical Interconnection with Si Nano-Photonics

Junichi FUJIKATA; Kenichi NISHI; Akiko GOMYO; Jun USHIDA; Tsutomu ISHI; Hiroaki YUKAWA; Daisuke OKAMOTO; Masafumi NAKADA; Takanori SHIMIZU; Masao KINOSHITA; Koichi NOSE; Masayuki MIZUNO; Tai TSUCHIZAWA; Toshifumi WATANABE; Koji YAMADA; Seiichi ITABASHI; Keishi OHASHI

doi:10.1093/ietele/e91-c.2.131

Special Section on Silicon Photonics Technologies and Their Applications

LSI On-Chip Optical Interconnection with Si Nano-Photonics

Junichi FUJIKATA, Kenichi NISHI, Akiko GOMYO, Jun USHIDA, Tsutomu ISHI, Hiroaki YUKAWA, Daisuke OKAMOTO, Masafumi NAKADA, Takanori SHIMIZU, Masao KINOSHITA, Koichi NOSE, Masayuki MIZUNO, Tai TSUCHIZAWA, Toshifumi WATANABE, Koji YAMADA, Seiichi ITABASHI, Keishi OHASHI

Author information

Junichi FUJIKATA
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Kenichi NISHI
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Akiko GOMYO
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
The Institute of Electronics, Information and Communication Engineers
Jun USHIDA
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Tsutomu ISHI
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Hiroaki YUKAWA
MIRAI-Selete
Daisuke OKAMOTO
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Masafumi NAKADA
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Takanori SHIMIZU
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
Masao KINOSHITA
MIRAI-Selete
Koichi NOSE
MIRAI-Selete
Device Platform Res. Labs., NEC Corp.
Masayuki MIZUNO
MIRAI-Selete
Device Platform Res. Labs., NEC Corp.
Tai TSUCHIZAWA
NTT Microsystem Integration Laboratories, NTT Corporation
Toshifumi WATANABE
NTT Microsystem Integration Laboratories, NTT Corporation
Koji YAMADA
NTT Microsystem Integration Laboratories, NTT Corporation
The Institute of Electronics, Information and Communication Engineers
Seiichi ITABASHI
NTT Microsystem Integration Laboratories, NTT Corporation
Keishi OHASHI
Nano Electronics Res. Labs., NEC Corp.
MIRAI-Selete
The Institute of Electronics, Information and Communication Engineers

Keywords: optical interconnect, LSI, Si nano-photonics, SiON waveguide, Si nano-photodiode, surface plasmon antenna, TIA-less optical clock circuit

JOURNAL RESTRICTED ACCESS

2008 Volume E91.C Issue 2 Pages 131-137

DOI https://doi.org/10.1093/ietele/e91-c.2.131

Details

Abstract

LSI on-chip optical interconnections are discussed from the viewpoint of a comparison between optical and electrical interconnections. Based on a practical prediction of our optical device development, optical interconnects will have an advantage over electrical interconnects within a chip that has an interconnect length less than about 10mm at the hp32-22nm technology node. Fundamental optical devices and components used in interconnections have also been introduced that are small enough to be placed on top of a Si LSI and that can be fabricated using methods compatible with CMOS processes. A SiON waveguide showed a low propagation loss around 0.3dB/cm at a wavelength of 850nm, and excellent branching characteristics were achieved for MMI (multimode interference) branch structures. A Si nano-photodiode showed highly enhanced speed and efficiency with a surface plasmon antenna. By combining our Si nano-photonic devices with the advanced TIA-less optical clock distribution circuits, clock distribution above 10GHz can be achieved with a small footprint on an LSI chip.

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