Abstract:
Using the SLID-ICV technology from Fraunhofer EMFT ('Solid-liquid-InterDiffusion' and 'Inter Chip Vias'[1]) thin pixel sensors (75μm-150μm) with 50μm × 400μm pixel size a...Show MoreMetadata
Abstract:
Using the SLID-ICV technology from Fraunhofer EMFT ('Solid-liquid-InterDiffusion' and 'Inter Chip Vias'[1]) thin pixel sensors (75μm-150μm) with 50μm × 400μm pixel size are connected to the readout ASICs (ATLAS FE-I3). These technologies offer the possibility to construct pixel detectors for application in high energy physics (and elsewhere) with improved properties like smaller pixel size, less material, better fill factor, and backside connectivity. The project is performed in two stages. First sensor and ASIC are connected with the SLID technology. In a second stage this concept will be complemented with vias. Results of step one and status of step two will be reported.
Published in: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International
Date of Conference: 31 January 2012 - 02 February 2012
Date Added to IEEE Xplore: 16 August 2012
ISBN Information:
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