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Low temperature (<180 °C) bonding for 3D integration | IEEE Conference Publication | IEEE Xplore

Low temperature (<180 °C) bonding for 3D integration


Abstract:

Three types of bonding, including Cu-In, Sn/In-Cu, and Cu/Ti-Ti/Cu, are investigated for the application of 3D interconnects. Cu-In bonding and Sn/In-Cu bonding can form ...Show More

Abstract:

Three types of bonding, including Cu-In, Sn/In-Cu, and Cu/Ti-Ti/Cu, are investigated for the application of 3D interconnects. Cu-In bonding and Sn/In-Cu bonding can form intermetallic compounds at the bonding temperature lower than 180 °C. In addition, for Cu/Ti-Ti/Cu bonding, Cu can be protected from oxidation by capping Ti on Cu surface before bonding. This method can further decrease bonding temperature. All bonded structures have shown excellent electrical performance and reliability characteristics. Based on bond results, these structures can be applied for low temperature bonding in 3D interconnects.
Date of Conference: 02-04 October 2013
Date Added to IEEE Xplore: 09 January 2014
Electronic ISBN:978-1-4673-6484-3
Conference Location: San Francisco, CA, USA

References

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