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High-speed via hole filling using electrophoresis of Ag nanoparticles | IEEE Conference Publication | IEEE Xplore

High-speed via hole filling using electrophoresis of Ag nanoparticles


Abstract:

As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a...Show More

Abstract:

As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250°C, the electric conductivity was 1.57 × 10-5 [Ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.
Date of Conference: 31 August 2015 - 02 September 2015
Date Added to IEEE Xplore: 23 November 2015
ISBN Information:
Conference Location: Sendai, Japan

References

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