In this paper, we demonstrate the effect on the heat management by adding both fin to Thermal Through Silicon Vias (TTSV) and heat spreaders to the conventional Three Dimensional Integrated Circuit (3D IC) structure. Various effects such as thermal cooling and its impact on distribution of potential across IC at different conditions have been simulated using COMSOL Multiphysics with various architectures such as: (1) 3D IC structure with no fins and spreaders, (2) TTSV with fins and spreaders made of graphene, and (3) TTSV with fins and heat spreaders made of Carbon Nanotube (CNT). Our result yielded, CNT being better thermal cooling material compared to graphene of order greater than 100 K. Furthermore, finned structure with heat spreaders added an extra cooling advantage of the order greater than 400 K. But performance of graphene with fin structure is better as per signal integrity point of view. Conclusively thermal management can be improved efficiently with the above proposed 3D IC structures.