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T/R-Switch Composed of 3 High-Voltage MOSFETs with 12.1 µW Consumption that can Perform Per-channel TX to RX Self-Loopback AC Tests for 3D Ultrasound Imaging with 3072-channel Transceiver | IEEE Conference Publication | IEEE Xplore
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T/R-Switch Composed of 3 High-Voltage MOSFETs with 12.1 µW Consumption that can Perform Per-channel TX to RX Self-Loopback AC Tests for 3D Ultrasound Imaging with 3072-channel Transceiver


Abstract:

This paper presents an area- and power-efficient TX/RX-isolation switch implemented in a 3072-ch ultrasound transceiver IC. The proposed dynamic gate-source shunt topolog...Show More

Abstract:

This paper presents an area- and power-efficient TX/RX-isolation switch implemented in a 3072-ch ultrasound transceiver IC. The proposed dynamic gate-source shunt topology, which utilizes a negative-HV-transmit-driven shunt switch, eliminates area- and power-hungry HV level shifters and ensures OFF during TX periods. In addition, source-driven HV-PMOS for ON/OFF control enables both gate charging and discharging using single HV-PMOS, thus contributing to area reduction. Moreover, by preparing an attenuation mode, a per-channel TX to RX self-loopback test can be performed. This function provides an on-wafer AC test without probing 3072 electrodes and can be applied to field diagnosis of assembled ultrasound probes.
Date of Conference: 04-06 November 2019
Date Added to IEEE Xplore: 06 April 2020
ISBN Information:
Conference Location: Macau, Macao

References

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